Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
SN74AVC16244DGVR Texas Instruments	IC BUF NON-INVERT 3.6V 48TVSOP	7639
SN74ALS652A-1DW Texas Instruments	IC TXRX NON-INVERT 5.5V 24SOIC	4126
SN74BCT2244DW Texas Instruments	IC BUFFER NON-INVERT 5.5V 20SOIC	4285
84071012A Texas Instruments	SN54HC374 OCTAL D-TYPE EDGE-TRIG	199
SN74LV367APWRG4 Texas Instruments	IC BUF NON-INVERT 5.5V 16TSSOP	0
SN74LS541DW Texas Instruments	IC BUF NON-INVERT 5.25V 20SOIC	491
SN74LS125AN Texas Instruments	IC BUF NON-INVERT 5.25V 14DIP	125810000
CY74FCT245CTSOCT Texas Instruments	IC TXRX NON-INVERT 5.25V 20SOIC	36000
SN74AVC16245DGG Texas Instruments	BUS TRANSCEIVER	5244
SN74HCT541DWE4 Texas Instruments	IC BUF NON-INVERT 5.5V 20SOIC	0
SN74ABTH245DGVR Texas Instruments	IC TXRX NON-INVERT 5.5V 20TVSOP	8000
SN54F240J Texas Instruments	54F240 OCTAL BUFFERS/DRIVERS WIT	37
74LVT16245BDGGRE4 Texas Instruments	IC TXRX NON-INVERT 3.6V 48TSSOP	0
CY74FCT2245ATPWR Texas Instruments	IC TXRX NON-INVERT 5.25V 20TSSOP	1326
SN74AVC4T245RGYR Texas Instruments	IC TRANSLATION TXRX 3.6V 16VQFN	0
SN64BCT126AN Texas Instruments	IC BUFFER NON-INVERT 5.5V 14DIP	31230
CD74HCT241E Texas Instruments	IC BUFFER NON-INVERT 5.5V 20DIP	11613
SN74ACT534PWLE Texas Instruments	BUS DRIVER, ACT SERIES, 8-BIT	3000
SN74ALS620AN Texas Instruments	IC TRANSCEIVER INVERT 5.5V 20DIP	11
SN74LVC827ADBR Texas Instruments	IC BUF NON-INVERT 3.6V 24SSOP	397

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications