Embedded - Microprocessors

Image Part Number Description / PDF Quantity Rfq
MPC8247VRTMFA

MPC8247VRTMFA

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCHITEC

3457

P2010NXN2KFC

P2010NXN2KFC

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ, 32-BIT POWER ARCH SOC, 1G

148

MCIMX233DJM4B

MCIMX233DJM4B

Freescale Semiconductor, Inc. (NXP Semiconductors)

MICROPROCESSOR, CMOS, PBGA169

9742

KMPC8540CVT667JB

KMPC8540CVT667JB

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC III MICROPROCESSOR, 6

0

MCIMX31CVMN4CR2

MCIMX31CVMN4CR2

Freescale Semiconductor, Inc. (NXP Semiconductors)

I.MX31 32-BIT MPU, ARM1136JF-S C

660

MC68EC040FE33A

MC68EC040FE33A

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU M68000 RISC 32-BIT HCMOS

1716

MC9S12DG128BMFU

MC9S12DG128BMFU

Freescale Semiconductor, Inc. (NXP Semiconductors)

16-BIT, FLASH, 25MHZ PQFP80

0

MPC8572ECVTAULD

MPC8572ECVTAULD

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 1333MHZ, PBGA1023

225

P1013NXE2HFB

P1013NXE2HFB

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ, 32 BIT POWER ARCH SOC, 80

27

MPC8360CZUAGDGA

MPC8360CZUAGDGA

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSOR,

651

MC9328MXLCVM15

MC9328MXLCVM15

Freescale Semiconductor, Inc. (NXP Semiconductors)

DRAGONBALL CORSICA PB-FR

74

MPC8572EPXARLD

MPC8572EPXARLD

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 1067MHZ, PBGA1023

4772

KMPC8379CVRALG

KMPC8379CVRALG

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 400MHZ, PBGA689

2

P1010NXN5HFA

P1010NXN5HFA

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ RISC MICROPROCESSOR, POWER

3165

MPC860PZQ80D4R2518

MPC860PZQ80D4R2518

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCHITEC

180

P1021NXN2FFB

P1021NXN2FFB

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ, POWER ARCH 32-BIT SOC, 2

73

P1015NSE5FFB

P1015NSE5FFB

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ, POWER ARCH 32-BIT SOC, 66

123

MPC8315VRADDA

MPC8315VRADDA

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCH SOC

1584

MC7447AVS1000NB

MC7447AVS1000NB

Freescale Semiconductor, Inc. (NXP Semiconductors)

RISC MICROPROCESSOR, 32 BIT, POW

44

MC9S12XDQ256VPV

MC9S12XDQ256VPV

Freescale Semiconductor, Inc. (NXP Semiconductors)

16-BIT, FLASH, CPU12 CPU, 40MHZ

2580

Embedded - Microprocessors

1. Overview

Embedded microprocessors are specialized computing units designed for dedicated control, monitoring, or processing tasks within electronic systems. Unlike general-purpose CPUs, they integrate processing cores, memory interfaces, and peripheral controllers into a single chip (SoC) to optimize performance, power efficiency, and cost for specific applications. These devices form the backbone of modern IoT, automotive systems, industrial automation, and consumer electronics.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
ARM Cortex-M SeriesLow-power 32-bit cores with real-time capabilities, optional DSP extensionsSmart sensors, wearables, motor control
PowerPCHigh reliability, floating-point units, automotive/Aerospace focusedVehicle ECUs, avionics systems
MIPSEfficient pipelining, 32/64-bit variants for multimedia processingNetworking equipment, set-top boxes
RISC-VOpen instruction set, modular architecture for customizationAI accelerators, edge computing devices
x86 (Embedded)PC compatibility, high processing power with integrated GPUsIndustrial PCs, medical imaging equipment

3. Architecture and Components

A typical embedded microprocessor contains:

  • Processing Core(s): RISC/Complex Instruction Set architectures with 1-8 cores
  • Memory Subsystem: Integrated SRAM, ROM, and external DRAM controllers
  • Peripheral Interfaces: UART, SPI, I2C, USB, CAN, PCIe, Ethernet MAC
  • Real-Time Components: Watchdog timers, PWM generators, ADC/DAC modules
  • Power Management: Multiple sleep modes, DVFS (Dynamic Voltage/Frequency Scaling)

4. Key Technical Specifications

ParameterDescriptionImportance
Clock FrequencyOperating speed (10MHz-6GHz)Determines processing throughput
Instruction SetRISC vs CISC architectureAffects code density and power consumption
TDP (Thermal Design Power)Power consumption under load (100mW-50W)Dictates thermal management requirements
Process NodeManufacturing technology (28nm-5nm)Impacts performance and energy efficiency
Memory BandwidthData transfer rate between core and memoryLimits performance in data-intensive tasks

5. Application Domains

  • Consumer Electronics: Smartphones (application processors), home appliances
  • Automotive: ADAS controllers, engine management systems
  • Industrial: PLCs (Programmable Logic Controllers), robotics
  • Healthcare: MRI scanners, portable diagnostic devices
  • Communications: 5G base stations, optical network transceivers

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
ARM HoldingsCortex-A78128-bit NEON engine, 4nm process, 3.0GHz
IntelAtom x6425EQuad-core, 12W TDP, integrated Intel HD Graphics
NXP Semiconductorsi.MX 8M Plus1.8GHz Cortex-A53, NPU for ML acceleration
MicrochipSAM9X6032-bit ARM926EJ-S, 120MHz, ECC memory support
QualcommQCS610Hexagon DSP, Adreno GPU, AI Engine for computer vision

7. Selection Guidelines

Key considerations include:

  • Performance requirements vs power budget (e.g., Cortex-M55 for ultra-low-power AI)
  • Real-time constraints (deterministic latency for motor control applications)
  • Peripheral integration (CAN FD for automotive networks)
  • Software ecosystem (RTOS support, middleware availability)
  • Longevity and supply chain stability (automotive-grade qualification)

Case Study: A smart thermostat design selected NXP's MCIMX7U5 (Cortex-M4 + Cortex-A7) for its combination of real-time sensor processing and application-layer connectivity.

8. Industry Trends

Emerging directions include:

  • AI integration: On-chip neural processing units (NPUs) for edge ML inference
  • Heterogeneous computing: Multi-architecture SoCs (RISC-V + GPU + NPU)
  • Advanced packaging: 3D-stacked memory integration for bandwidth-intensive applications
  • Functional safety: ISO 26262 compliance for autonomous vehicle systems
  • Open ecosystems: Growth of RISC-V adoption in custom ASIC designs
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