Embedded - Microprocessors

Image Part Number Description / PDF Quantity Rfq
MPC8306SCVMAFDCA

MPC8306SCVMAFDCA

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC POWER ARCH SOC, 333MH

5040

MPC8377VRALG

MPC8377VRALG

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSOR,

1769

MPC8535BVTAKG

MPC8535BVTAKG

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 600MHZ, PBGA783

0

M68LC302CAF20VCT-FR

M68LC302CAF20VCT-FR

Freescale Semiconductor, Inc. (NXP Semiconductors)

LAN CONTROLLER, 4 CHANNEL(S), 1.

50

MPC8536ECVTAQGA

MPC8536ECVTAQGA

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 1000MHZ, PBGA783

20

MC68P11E1CFN2R2

MC68P11E1CFN2R2

Freescale Semiconductor, Inc. (NXP Semiconductors)

8-BIT, 2MHZ, HCMOS, PQCC52

450

MC9328MXLVP15R2

MC9328MXLVP15R2

Freescale Semiconductor, Inc. (NXP Semiconductors)

32-BIT, 150MHZ, CMOS, PBGA225

0

MCIMX502CVK8B

MCIMX502CVK8B

Freescale Semiconductor, Inc. (NXP Semiconductors)

I.MX50 32-BIT MPU, ARM CORTEX-A8

30

P4080NSE7PNAC

P4080NSE7PNAC

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ, 32-BIT POWER ARCH SOC, 8

217

P1021NSN2DFB

P1021NSN2DFB

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ, POWER ARCH 32-BIT SOC, 2

267

MPC860DPVR80D4

MPC860DPVR80D4

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCHITEC

97

MPC860DPZQ66D4

MPC860DPZQ66D4

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCHITEC

1974

MPC8248ZQTIEA

MPC8248ZQTIEA

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCHITEC

1086

MPC8536EBVTAVLA

MPC8536EBVTAVLA

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 1500MHZ, PBGA783

361

P4081NSE7MMC

P4081NSE7MMC

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ, 32-BIT POWER ARCH SOC, 8

42

MCIMX27MJP4A

MCIMX27MJP4A

Freescale Semiconductor, Inc. (NXP Semiconductors)

I.MX27 32 BIT MICROPROCESSOR, AR

4032

MPC8568EVTAUJJ

MPC8568EVTAUJJ

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSOR,

45

MCIMX6D4AVT10AC

MCIMX6D4AVT10AC

Freescale Semiconductor, Inc. (NXP Semiconductors)

I.MX 6 SERIES 32 BIT MPU, DUAL A

6882

XPC8255VVIFBC

XPC8255VVIFBC

Freescale Semiconductor, Inc. (NXP Semiconductors)

RISC MICROPROCESSOR, 32 BIT, POW

8

MPC8308VMAGD

MPC8308VMAGD

Freescale Semiconductor, Inc. (NXP Semiconductors)

RISC MCU, 32-BIT, 400MHZ

1396

Embedded - Microprocessors

1. Overview

Embedded microprocessors are specialized computing units designed for dedicated control, monitoring, or processing tasks within electronic systems. Unlike general-purpose CPUs, they integrate processing cores, memory interfaces, and peripheral controllers into a single chip (SoC) to optimize performance, power efficiency, and cost for specific applications. These devices form the backbone of modern IoT, automotive systems, industrial automation, and consumer electronics.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
ARM Cortex-M SeriesLow-power 32-bit cores with real-time capabilities, optional DSP extensionsSmart sensors, wearables, motor control
PowerPCHigh reliability, floating-point units, automotive/Aerospace focusedVehicle ECUs, avionics systems
MIPSEfficient pipelining, 32/64-bit variants for multimedia processingNetworking equipment, set-top boxes
RISC-VOpen instruction set, modular architecture for customizationAI accelerators, edge computing devices
x86 (Embedded)PC compatibility, high processing power with integrated GPUsIndustrial PCs, medical imaging equipment

3. Architecture and Components

A typical embedded microprocessor contains:

  • Processing Core(s): RISC/Complex Instruction Set architectures with 1-8 cores
  • Memory Subsystem: Integrated SRAM, ROM, and external DRAM controllers
  • Peripheral Interfaces: UART, SPI, I2C, USB, CAN, PCIe, Ethernet MAC
  • Real-Time Components: Watchdog timers, PWM generators, ADC/DAC modules
  • Power Management: Multiple sleep modes, DVFS (Dynamic Voltage/Frequency Scaling)

4. Key Technical Specifications

ParameterDescriptionImportance
Clock FrequencyOperating speed (10MHz-6GHz)Determines processing throughput
Instruction SetRISC vs CISC architectureAffects code density and power consumption
TDP (Thermal Design Power)Power consumption under load (100mW-50W)Dictates thermal management requirements
Process NodeManufacturing technology (28nm-5nm)Impacts performance and energy efficiency
Memory BandwidthData transfer rate between core and memoryLimits performance in data-intensive tasks

5. Application Domains

  • Consumer Electronics: Smartphones (application processors), home appliances
  • Automotive: ADAS controllers, engine management systems
  • Industrial: PLCs (Programmable Logic Controllers), robotics
  • Healthcare: MRI scanners, portable diagnostic devices
  • Communications: 5G base stations, optical network transceivers

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
ARM HoldingsCortex-A78128-bit NEON engine, 4nm process, 3.0GHz
IntelAtom x6425EQuad-core, 12W TDP, integrated Intel HD Graphics
NXP Semiconductorsi.MX 8M Plus1.8GHz Cortex-A53, NPU for ML acceleration
MicrochipSAM9X6032-bit ARM926EJ-S, 120MHz, ECC memory support
QualcommQCS610Hexagon DSP, Adreno GPU, AI Engine for computer vision

7. Selection Guidelines

Key considerations include:

  • Performance requirements vs power budget (e.g., Cortex-M55 for ultra-low-power AI)
  • Real-time constraints (deterministic latency for motor control applications)
  • Peripheral integration (CAN FD for automotive networks)
  • Software ecosystem (RTOS support, middleware availability)
  • Longevity and supply chain stability (automotive-grade qualification)

Case Study: A smart thermostat design selected NXP's MCIMX7U5 (Cortex-M4 + Cortex-A7) for its combination of real-time sensor processing and application-layer connectivity.

8. Industry Trends

Emerging directions include:

  • AI integration: On-chip neural processing units (NPUs) for edge ML inference
  • Heterogeneous computing: Multi-architecture SoCs (RISC-V + GPU + NPU)
  • Advanced packaging: 3D-stacked memory integration for bandwidth-intensive applications
  • Functional safety: ISO 26262 compliance for autonomous vehicle systems
  • Open ecosystems: Growth of RISC-V adoption in custom ASIC designs
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