Embedded - Microprocessors

Image Part Number Description / PDF Quantity Rfq
P1012NSN2HFB

P1012NSN2HFB

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ INTEGRATED PROCESSOR

149

MCIMX515DVK8C

MCIMX515DVK8C

Freescale Semiconductor, Inc. (NXP Semiconductors)

I.MX51 32-BIT MPU, ARM CORTEX-A8

640

MPC857TVR66B

MPC857TVR66B

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSOR

165

MPC8543PXANGB

MPC8543PXANGB

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 800MHZ, PBGA783

27

MPC8547EVTAQGB

MPC8547EVTAQGB

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 1000MHZ, PBGA783

209

MC7447AVS1000LB

MC7447AVS1000LB

Freescale Semiconductor, Inc. (NXP Semiconductors)

32-BIT, 1000MHZ, CMOS, CBGA360

41

P5020NXE1TNB

P5020NXE1TNB

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ, 64-BIT POWER ARCH SOC, 2

36

MCIMX27MOP4A

MCIMX27MOP4A

Freescale Semiconductor, Inc. (NXP Semiconductors)

I.MX27 32 BIT MICROPROCESSOR, AR

893

MPC8544VTANGA

MPC8544VTANGA

Freescale Semiconductor, Inc. (NXP Semiconductors)

32-BIT, 800MHZ, CMOS, PBGA783

13

MPC8241LVR266D-FR

MPC8241LVR266D-FR

Freescale Semiconductor, Inc. (NXP Semiconductors)

RISC MICROCONTROLLER, 32 BIT, PO

30

P3041NXN1NNB

P3041NXN1NNB

Freescale Semiconductor, Inc. (NXP Semiconductors)

1333MHZ, CMOS, PBGA1295

1

MPC860PCVR50D4

MPC860PCVR50D4

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCHITEC

34

MC9S12DT128BVPV

MC9S12DT128BVPV

Freescale Semiconductor, Inc. (NXP Semiconductors)

16-BIT, FLASH, 25MHZ

449

MPC862PZQ80B

MPC862PZQ80B

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSOR

5392

MPC8545EPXANGB

MPC8545EPXANGB

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 800MHZ, PBGA783

156

MC68HC908QY2MP

MC68HC908QY2MP

Freescale Semiconductor, Inc. (NXP Semiconductors)

8-BIT, FLASH, 68HC08 CPU, 8MHZ

1930

MCIMX514AJM6C

MCIMX514AJM6C

Freescale Semiconductor, Inc. (NXP Semiconductors)

I.MX51 32-BIT MPU, ARM CORTEX-A8

34

MPC8548VJAQGD

MPC8548VJAQGD

Freescale Semiconductor, Inc. (NXP Semiconductors)

MICROPROCESSOR, 32-BIT

36

P1014NSE5DFA

P1014NSE5DFA

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ RISC MICROPROCESSOR, POWER

1249

MC9328MX21CJM

MC9328MX21CJM

Freescale Semiconductor, Inc. (NXP Semiconductors)

MICROPROCESSOR, 32 BIT, 266MHZ,

178

Embedded - Microprocessors

1. Overview

Embedded microprocessors are specialized computing units designed for dedicated control, monitoring, or processing tasks within electronic systems. Unlike general-purpose CPUs, they integrate processing cores, memory interfaces, and peripheral controllers into a single chip (SoC) to optimize performance, power efficiency, and cost for specific applications. These devices form the backbone of modern IoT, automotive systems, industrial automation, and consumer electronics.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
ARM Cortex-M SeriesLow-power 32-bit cores with real-time capabilities, optional DSP extensionsSmart sensors, wearables, motor control
PowerPCHigh reliability, floating-point units, automotive/Aerospace focusedVehicle ECUs, avionics systems
MIPSEfficient pipelining, 32/64-bit variants for multimedia processingNetworking equipment, set-top boxes
RISC-VOpen instruction set, modular architecture for customizationAI accelerators, edge computing devices
x86 (Embedded)PC compatibility, high processing power with integrated GPUsIndustrial PCs, medical imaging equipment

3. Architecture and Components

A typical embedded microprocessor contains:

  • Processing Core(s): RISC/Complex Instruction Set architectures with 1-8 cores
  • Memory Subsystem: Integrated SRAM, ROM, and external DRAM controllers
  • Peripheral Interfaces: UART, SPI, I2C, USB, CAN, PCIe, Ethernet MAC
  • Real-Time Components: Watchdog timers, PWM generators, ADC/DAC modules
  • Power Management: Multiple sleep modes, DVFS (Dynamic Voltage/Frequency Scaling)

4. Key Technical Specifications

ParameterDescriptionImportance
Clock FrequencyOperating speed (10MHz-6GHz)Determines processing throughput
Instruction SetRISC vs CISC architectureAffects code density and power consumption
TDP (Thermal Design Power)Power consumption under load (100mW-50W)Dictates thermal management requirements
Process NodeManufacturing technology (28nm-5nm)Impacts performance and energy efficiency
Memory BandwidthData transfer rate between core and memoryLimits performance in data-intensive tasks

5. Application Domains

  • Consumer Electronics: Smartphones (application processors), home appliances
  • Automotive: ADAS controllers, engine management systems
  • Industrial: PLCs (Programmable Logic Controllers), robotics
  • Healthcare: MRI scanners, portable diagnostic devices
  • Communications: 5G base stations, optical network transceivers

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
ARM HoldingsCortex-A78128-bit NEON engine, 4nm process, 3.0GHz
IntelAtom x6425EQuad-core, 12W TDP, integrated Intel HD Graphics
NXP Semiconductorsi.MX 8M Plus1.8GHz Cortex-A53, NPU for ML acceleration
MicrochipSAM9X6032-bit ARM926EJ-S, 120MHz, ECC memory support
QualcommQCS610Hexagon DSP, Adreno GPU, AI Engine for computer vision

7. Selection Guidelines

Key considerations include:

  • Performance requirements vs power budget (e.g., Cortex-M55 for ultra-low-power AI)
  • Real-time constraints (deterministic latency for motor control applications)
  • Peripheral integration (CAN FD for automotive networks)
  • Software ecosystem (RTOS support, middleware availability)
  • Longevity and supply chain stability (automotive-grade qualification)

Case Study: A smart thermostat design selected NXP's MCIMX7U5 (Cortex-M4 + Cortex-A7) for its combination of real-time sensor processing and application-layer connectivity.

8. Industry Trends

Emerging directions include:

  • AI integration: On-chip neural processing units (NPUs) for edge ML inference
  • Heterogeneous computing: Multi-architecture SoCs (RISC-V + GPU + NPU)
  • Advanced packaging: 3D-stacked memory integration for bandwidth-intensive applications
  • Functional safety: ISO 26262 compliance for autonomous vehicle systems
  • Open ecosystems: Growth of RISC-V adoption in custom ASIC designs
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