Embedded - Microprocessors

Image Part Number Description / PDF Quantity Rfq
MCIMX356AVM5B

MCIMX356AVM5B

Freescale Semiconductor, Inc. (NXP Semiconductors)

I.MX35 32-BIT MPU, ARM1136JF-S C

10813

MPC885ZP133

MPC885ZP133

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSOR,

36

MPC8545VTAQGD

MPC8545VTAQGD

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 1000MHZ, PBGA783

198

MPC8315ECVRAGDA

MPC8315ECVRAGDA

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCH SOC

827

MPC8541EPXAPF

MPC8541EPXAPF

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSORS,

110

MPC859PCVR100A

MPC859PCVR100A

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCHITEC

1272

MPC8379VRAGD

MPC8379VRAGD

Freescale Semiconductor, Inc. (NXP Semiconductors)

32-BIT, 400MHZ, CMOS, PBGA689

0

MC68HLC908QY4CDW

MC68HLC908QY4CDW

Freescale Semiconductor, Inc. (NXP Semiconductors)

8-BIT, FLASH, 68HC08 CPU, 2MHZ

705

MC705C8ACFNR2

MC705C8ACFNR2

Freescale Semiconductor, Inc. (NXP Semiconductors)

8-BIT, OTPROM, 2MHZ, HCMOS,

450

MC68HC908QT4CFQ

MC68HC908QT4CFQ

Freescale Semiconductor, Inc. (NXP Semiconductors)

8-BIT, FLASH, 68HC08 CPU, 8MHZ

109

MC68LC302AF20CT

MC68LC302AF20CT

Freescale Semiconductor, Inc. (NXP Semiconductors)

INTEGRATED MULTIPROTOCOL MICROPR

0

MCIMX6D4AVT08AC

MCIMX6D4AVT08AC

Freescale Semiconductor, Inc. (NXP Semiconductors)

I.MX 6 SERIES 32 BIT MPU, DUAL A

1005

MPC8347ECZUAGDB

MPC8347ECZUAGDB

Freescale Semiconductor, Inc. (NXP Semiconductors)

MICROPROCESSOR, 32-BIT, 400MHZ,

515

MPC8349VVAJFB

MPC8349VVAJFB

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCH SOC

1271

P1014NSN5HFA

P1014NSN5HFA

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ RISC MICROPROCESSOR, POWER

6992

MPC8544VTARJA

MPC8544VTARJA

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSORS,

16

XPC8260CZUIHBC

XPC8260CZUIHBC

Freescale Semiconductor, Inc. (NXP Semiconductors)

RISC MICROPROCESSOR, 32 BIT, POW

15

MCIMX502EVM8B

MCIMX502EVM8B

Freescale Semiconductor, Inc. (NXP Semiconductors)

I.MX50 32-BIT MPU, ARM CORTEX-A8

1099

MPC8536BVTATHA

MPC8536BVTATHA

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 1250MHZ, PBGA783

3

MPC8360VVAJDGA

MPC8360VVAJDGA

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCH SOC

95

Embedded - Microprocessors

1. Overview

Embedded microprocessors are specialized computing units designed for dedicated control, monitoring, or processing tasks within electronic systems. Unlike general-purpose CPUs, they integrate processing cores, memory interfaces, and peripheral controllers into a single chip (SoC) to optimize performance, power efficiency, and cost for specific applications. These devices form the backbone of modern IoT, automotive systems, industrial automation, and consumer electronics.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
ARM Cortex-M SeriesLow-power 32-bit cores with real-time capabilities, optional DSP extensionsSmart sensors, wearables, motor control
PowerPCHigh reliability, floating-point units, automotive/Aerospace focusedVehicle ECUs, avionics systems
MIPSEfficient pipelining, 32/64-bit variants for multimedia processingNetworking equipment, set-top boxes
RISC-VOpen instruction set, modular architecture for customizationAI accelerators, edge computing devices
x86 (Embedded)PC compatibility, high processing power with integrated GPUsIndustrial PCs, medical imaging equipment

3. Architecture and Components

A typical embedded microprocessor contains:

  • Processing Core(s): RISC/Complex Instruction Set architectures with 1-8 cores
  • Memory Subsystem: Integrated SRAM, ROM, and external DRAM controllers
  • Peripheral Interfaces: UART, SPI, I2C, USB, CAN, PCIe, Ethernet MAC
  • Real-Time Components: Watchdog timers, PWM generators, ADC/DAC modules
  • Power Management: Multiple sleep modes, DVFS (Dynamic Voltage/Frequency Scaling)

4. Key Technical Specifications

ParameterDescriptionImportance
Clock FrequencyOperating speed (10MHz-6GHz)Determines processing throughput
Instruction SetRISC vs CISC architectureAffects code density and power consumption
TDP (Thermal Design Power)Power consumption under load (100mW-50W)Dictates thermal management requirements
Process NodeManufacturing technology (28nm-5nm)Impacts performance and energy efficiency
Memory BandwidthData transfer rate between core and memoryLimits performance in data-intensive tasks

5. Application Domains

  • Consumer Electronics: Smartphones (application processors), home appliances
  • Automotive: ADAS controllers, engine management systems
  • Industrial: PLCs (Programmable Logic Controllers), robotics
  • Healthcare: MRI scanners, portable diagnostic devices
  • Communications: 5G base stations, optical network transceivers

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
ARM HoldingsCortex-A78128-bit NEON engine, 4nm process, 3.0GHz
IntelAtom x6425EQuad-core, 12W TDP, integrated Intel HD Graphics
NXP Semiconductorsi.MX 8M Plus1.8GHz Cortex-A53, NPU for ML acceleration
MicrochipSAM9X6032-bit ARM926EJ-S, 120MHz, ECC memory support
QualcommQCS610Hexagon DSP, Adreno GPU, AI Engine for computer vision

7. Selection Guidelines

Key considerations include:

  • Performance requirements vs power budget (e.g., Cortex-M55 for ultra-low-power AI)
  • Real-time constraints (deterministic latency for motor control applications)
  • Peripheral integration (CAN FD for automotive networks)
  • Software ecosystem (RTOS support, middleware availability)
  • Longevity and supply chain stability (automotive-grade qualification)

Case Study: A smart thermostat design selected NXP's MCIMX7U5 (Cortex-M4 + Cortex-A7) for its combination of real-time sensor processing and application-layer connectivity.

8. Industry Trends

Emerging directions include:

  • AI integration: On-chip neural processing units (NPUs) for edge ML inference
  • Heterogeneous computing: Multi-architecture SoCs (RISC-V + GPU + NPU)
  • Advanced packaging: 3D-stacked memory integration for bandwidth-intensive applications
  • Functional safety: ISO 26262 compliance for autonomous vehicle systems
  • Open ecosystems: Growth of RISC-V adoption in custom ASIC designs
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