Embedded - Microprocessors

Image Part Number Description / PDF Quantity Rfq
MPC885VR133

MPC885VR133

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCHITEC

0

MC68EN360CAI25L

MC68EN360CAI25L

Freescale Semiconductor, Inc. (NXP Semiconductors)

RISC MICROCONTROLLER, CMOS, PQFP

5

MPC857TZQ80B

MPC857TZQ80B

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSOR

44

MPC875ZT80

MPC875ZT80

Freescale Semiconductor, Inc. (NXP Semiconductors)

RISC MPU, 32-BIT, 80MHZ

211

MPC853TVR66A

MPC853TVR66A

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCHITEC

24

MPC8544CVTANGA

MPC8544CVTANGA

Freescale Semiconductor, Inc. (NXP Semiconductors)

32-BIT, 800MHZ, CMOS, PBGA783

0

MPC8545EPXATGB

MPC8545EPXATGB

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 1200MHZ, PBGA783

1

MCIMX508CVM8BR2

MCIMX508CVM8BR2

Freescale Semiconductor, Inc. (NXP Semiconductors)

I.MX50 32-BIT MPU, ARM CORTEX-A8

13630

MPC8241TVR200D

MPC8241TVR200D

Freescale Semiconductor, Inc. (NXP Semiconductors)

RISC MICROCONTROLLER, 32 BIT, PO

0

MPC8347ECZQADDB

MPC8347ECZQADDB

Freescale Semiconductor, Inc. (NXP Semiconductors)

MICROPROCESSOR, 32-BIT, 266MHZ,

770

P1013NSN2LFB

P1013NSN2LFB

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ, 32 BIT POWER ARCH SOC, 1G

64

MPC8313EZQAFF

MPC8313EZQAFF

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 333MHZ, PBGA516

40

MPC860DTVR66D4

MPC860DTVR66D4

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCHITEC

70

MPC860PZQ80D4557

MPC860PZQ80D4557

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSOR

0

MPC8548EVTAUJC

MPC8548EVTAUJC

Freescale Semiconductor, Inc. (NXP Semiconductors)

RISC MICROPROCESSOR, CMOS

0

P1011NXE2DFB

P1011NXE2DFB

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ, POWER ARCH 32-BIT SOC, 53

0

MC8640DVU1000HE

MC8640DVU1000HE

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 1000MHZ, CBGA1023

0

MC68040FE33V

MC68040FE33V

Freescale Semiconductor, Inc. (NXP Semiconductors)

MICROPROCESSOR, 32 BIT, MC68000

825

P2041NSE1NNB

P2041NSE1NNB

Freescale Semiconductor, Inc. (NXP Semiconductors)

RISC MICROPROCESSOR, CMOS

84

MC9328MX21VK

MC9328MX21VK

Freescale Semiconductor, Inc. (NXP Semiconductors)

MICROPROCESSOR, 32 BIT, 266MHZ,

912

Embedded - Microprocessors

1. Overview

Embedded microprocessors are specialized computing units designed for dedicated control, monitoring, or processing tasks within electronic systems. Unlike general-purpose CPUs, they integrate processing cores, memory interfaces, and peripheral controllers into a single chip (SoC) to optimize performance, power efficiency, and cost for specific applications. These devices form the backbone of modern IoT, automotive systems, industrial automation, and consumer electronics.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
ARM Cortex-M SeriesLow-power 32-bit cores with real-time capabilities, optional DSP extensionsSmart sensors, wearables, motor control
PowerPCHigh reliability, floating-point units, automotive/Aerospace focusedVehicle ECUs, avionics systems
MIPSEfficient pipelining, 32/64-bit variants for multimedia processingNetworking equipment, set-top boxes
RISC-VOpen instruction set, modular architecture for customizationAI accelerators, edge computing devices
x86 (Embedded)PC compatibility, high processing power with integrated GPUsIndustrial PCs, medical imaging equipment

3. Architecture and Components

A typical embedded microprocessor contains:

  • Processing Core(s): RISC/Complex Instruction Set architectures with 1-8 cores
  • Memory Subsystem: Integrated SRAM, ROM, and external DRAM controllers
  • Peripheral Interfaces: UART, SPI, I2C, USB, CAN, PCIe, Ethernet MAC
  • Real-Time Components: Watchdog timers, PWM generators, ADC/DAC modules
  • Power Management: Multiple sleep modes, DVFS (Dynamic Voltage/Frequency Scaling)

4. Key Technical Specifications

ParameterDescriptionImportance
Clock FrequencyOperating speed (10MHz-6GHz)Determines processing throughput
Instruction SetRISC vs CISC architectureAffects code density and power consumption
TDP (Thermal Design Power)Power consumption under load (100mW-50W)Dictates thermal management requirements
Process NodeManufacturing technology (28nm-5nm)Impacts performance and energy efficiency
Memory BandwidthData transfer rate between core and memoryLimits performance in data-intensive tasks

5. Application Domains

  • Consumer Electronics: Smartphones (application processors), home appliances
  • Automotive: ADAS controllers, engine management systems
  • Industrial: PLCs (Programmable Logic Controllers), robotics
  • Healthcare: MRI scanners, portable diagnostic devices
  • Communications: 5G base stations, optical network transceivers

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
ARM HoldingsCortex-A78128-bit NEON engine, 4nm process, 3.0GHz
IntelAtom x6425EQuad-core, 12W TDP, integrated Intel HD Graphics
NXP Semiconductorsi.MX 8M Plus1.8GHz Cortex-A53, NPU for ML acceleration
MicrochipSAM9X6032-bit ARM926EJ-S, 120MHz, ECC memory support
QualcommQCS610Hexagon DSP, Adreno GPU, AI Engine for computer vision

7. Selection Guidelines

Key considerations include:

  • Performance requirements vs power budget (e.g., Cortex-M55 for ultra-low-power AI)
  • Real-time constraints (deterministic latency for motor control applications)
  • Peripheral integration (CAN FD for automotive networks)
  • Software ecosystem (RTOS support, middleware availability)
  • Longevity and supply chain stability (automotive-grade qualification)

Case Study: A smart thermostat design selected NXP's MCIMX7U5 (Cortex-M4 + Cortex-A7) for its combination of real-time sensor processing and application-layer connectivity.

8. Industry Trends

Emerging directions include:

  • AI integration: On-chip neural processing units (NPUs) for edge ML inference
  • Heterogeneous computing: Multi-architecture SoCs (RISC-V + GPU + NPU)
  • Advanced packaging: 3D-stacked memory integration for bandwidth-intensive applications
  • Functional safety: ISO 26262 compliance for autonomous vehicle systems
  • Open ecosystems: Growth of RISC-V adoption in custom ASIC designs
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