Transistors - IGBTs - Modules

Image Part Number Description / PDF Quantity Rfq
FF600R12KF4NOSA1

FF600R12KF4NOSA1

IR (Infineon Technologies)

IGBT MODULE

28

FP10R12KE3BOMA1

FP10R12KE3BOMA1

IR (Infineon Technologies)

MOD IGBT LOW PWR EASY2-1

0

BSM200GA120DN2HOSA1

BSM200GA120DN2HOSA1

IR (Infineon Technologies)

IGBT MOD 1200V 300A 1550W

0

FZ500R65KE3C1NPSA1

FZ500R65KE3C1NPSA1

IR (Infineon Technologies)

IHV IHM T XHP 3 3-6 5K

0

FZ2400R12KE3NOSA1

FZ2400R12KE3NOSA1

IR (Infineon Technologies)

IGBT MODULE

68

BSM100GB120DN2B2HOSA1

BSM100GB120DN2B2HOSA1

IR (Infineon Technologies)

IGBT MODULE

17

BSM75GAR120DN2HOSA1

BSM75GAR120DN2HOSA1

IR (Infineon Technologies)

IGBT MODULE

5

DF75R12W1H4FB11BOMA2

DF75R12W1H4FB11BOMA2

IR (Infineon Technologies)

IGBT MOD 1200V 25A 20MW

0

FF450R33T3E3B5P2BPSA1

FF450R33T3E3B5P2BPSA1

IR (Infineon Technologies)

IHV IHM T XHP 3 3-6 5K

0

FP35R12KT4B16BOSA1

FP35R12KT4B16BOSA1

IR (Infineon Technologies)

IGBT MOD 1200V 70A 210W

0

FF800R12KL4CNOSA1

FF800R12KL4CNOSA1

IR (Infineon Technologies)

FF800R12 - INSULATED GATE BIPOLA

1

FP100R12KT4B11BOSA1

FP100R12KT4B11BOSA1

IR (Infineon Technologies)

FP100R12 - IGBT MODULE

18

FZ3600R12KE3NOSA1

FZ3600R12KE3NOSA1

IR (Infineon Technologies)

IGBT MODULE

8

BSM35GD120DLCE3224BOSA1

BSM35GD120DLCE3224BOSA1

IR (Infineon Technologies)

LOW POWER ECONO

4

PS2GFANSET30599NOSA1

PS2GFANSET30599NOSA1

IR (Infineon Technologies)

MOD IGBT STACK PSAO-1

0

BSM50GD120DN2BOSA1

BSM50GD120DN2BOSA1

IR (Infineon Technologies)

IGBT MOD 1200V 72A 350W

0

FD-DF80R12W1H3_B52

FD-DF80R12W1H3_B52

IR (Infineon Technologies)

IGBT MOD 1200V 40A 215W

0

FZ400R17KE3S4HOSA1

FZ400R17KE3S4HOSA1

IR (Infineon Technologies)

IGBT MODULE

40

900546CHOSA1

900546CHOSA1

IR (Infineon Technologies)

IGBT MODULE

0

FD600R17KE3KB5NOSA1

FD600R17KE3KB5NOSA1

IR (Infineon Technologies)

IGBT MODULE 1700V 4300W

0

Transistors - IGBTs - Modules

1. Overview

Insulated Gate Bipolar Transistors (IGBTs) modules are hybrid semiconductor devices combining the high input impedance of MOSFETs with the low conduction losses of bipolar transistors. They serve as critical components in high-power switching applications, enabling efficient energy conversion in industrial, automotive, and consumer systems. Their ability to handle high voltage/current with fast switching characteristics makes them indispensable in modern power electronics.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Standard IGBT ModulesGeneral-purpose, balanced conduction/switching lossesIndustrial motor drives, HVAC systems
High-Speed IGBTsOptimized for switching frequencies >20kHzWelding inverters, induction heating
Enhanced Dynamic IGBTsReduced tail current for lower switching lossesElectric vehicle (EV) on-board chargers
Trench IGBTsVertical trench gate structure for improved efficiencySolar inverters, energy storage systems
Double-Sided Cooling ModulesThermal management with cooling on both sidesHigh-power traction systems, wind turbines

3. Structure and Composition

IGBT modules typically consist of multiple IGBT dies and freewheeling diodes mounted on a ceramic substrate (usually Al2O3 or Si3N4). Key structural elements include:

  • Chip-level integration of IGBT and diode cells
  • DBC (Direct Bonded Copper) substrate for thermal conductivity
  • Thermoplastic/epoxy encapsulation for insulation
  • Aluminum wire bonds for die interconnection
  • Integrated temperature sensors in advanced modules

4. Key Technical Specifications

ParameterDescriptionImportance
Rated Collector Current (IC)Maximum continuous operating currentDetermines power handling capability
Breakdown Voltage (VCE)Max voltage before conductionSystem voltage rating compatibility
Conduction Voltage DropVoltage loss during on-stateImpacts efficiency and thermal design
Switching Losses (Eon/Eoff)Energy loss during state transitionsDictates maximum switching frequency
Operating Temperature RangeValid junction temperature rangeReliability and lifespan factor
Isolation VoltageDielectric strength between layersSafety compliance for high-voltage systems

5. Application Areas

  • Industrial: Motor drives, CNC machines, welding equipment
  • Automotive: EV traction inverters, PHEV battery management
  • Energy: Solar PV inverters, wind turbine converters
  • Consumer: High-end home appliances with variable speed drives
  • Rail: Traction systems for high-speed trains and metro networks

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Specifications
InfineonFF600R12KE4600A/1200V, 3-level topology, 175 C rating
ON SemiconductorNVHL015AN150A/1200V, automotive qualified
Mitsubishi ElectricCM400DY-34A400A/1700V, double-sided cooling
Fuji Electric2MBI150XAA120-50150A/1200V, intelligent power module
STMicroelectronicsSTGF8NC60KD8A/600V, through-hole package

7. Selection Guidelines

Key considerations include:

  • Matching voltage/current ratings with system requirements
  • Switching frequency vs. conduction loss trade-off
  • Thermal management capabilities (Rth values)
  • Short-circuit withstand capability
  • Package dimensions and cooling interface compatibility
  • Functional safety requirements (e.g., ISO 26262 for automotive)

8. Industry Trends

Emerging trends include:

  • Transition to SiC/GaN hybrid modules for higher efficiency
  • Development of 3D packaging for reduced parasitic inductance
  • Integration of gate drivers and sensors in smart modules
  • Growing adoption in EV charging infrastructure (800V+ systems)
  • Advancements in sintering technology for die attach reliability
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