Transistors - IGBTs

Transistors - IGBTs - Modules

Part Number	Description / PDF	Quantity
APT35GP120J Roving Networks / Microchip Technology	IGBT MOD 1200V 64A 284W ISOTOP	2
FP10R12W1T4BOMA1 IR (Infineon Technologies)	IGBT MOD 1200V 20A 105W	22
2ED300C17SROHSBPSA1 IR (Infineon Technologies)	IGBT MODULE 1700V 30A	36
F3L300R12MT4B23BOSA1 IR (Infineon Technologies)	F3L300R12 - IGBT MODULE	40
FMG1G100US60L	IGBT, 100A, 600V, N-CHANNEL	46
FD16001200R17HP4B2BOSA2 IR (Infineon Technologies)	IGBT MODULE VCES 1700V 1600A	0
DF200R12KE3HOSA1 IR (Infineon Technologies)	IGBT MODULE 1200V 1040W	0
FF650R17IE4DB2BOSA1 IR (Infineon Technologies)	IGBT MODULE 1700V 4150W	0
FZ2400R12HE4B9HOSA2 IR (Infineon Technologies)	FZ2400R12 - IGBT MODULE	109
MG12300D-BN2MM Wickmann / Littelfuse	IGBT MODULE 1200V 480A 1450W D3	0
FS400R12A2T4BOSA1 IR (Infineon Technologies)	IGBT MODULES	3
IFF2400P17AE4BPSA1 IR (Infineon Technologies)	IFF2400P17 - AC/DC POWER MODULES	5
F3L25R12W1T4B27BOMA1 IR (Infineon Technologies)	MODULE IGBT 1200V EASY1B-2	24
FS100R17N3E4BOSA1 IR (Infineon Technologies)	IGBT MOD 1700V 100A 600W	7
FZ500R65KE3NOSA1 IR (Infineon Technologies)	IGBT MODULE 6500V 1000A	0
FZ400R12KP4HOSA1 IR (Infineon Technologies)	IGBT MOD 1200V 400A 2400W	0
F475R12KS4B11BOSA1 IR (Infineon Technologies)	IGBT MOD 1200V 100A 500W	0
APTGLQ100A65T1G Roving Networks / Microchip Technology	IGBT MODULE 650V 200A 350W SP1	0
APTGLQ200HR120G Roving Networks / Microchip Technology	IGBT MODULE 1200V 300A 1000W SP6	0
GSID200A170S3B1 SemiQ	IGBT MODULE 1200V 400A 1630W D3	0

Transistors - IGBTs - Modules

1. Overview

Insulated Gate Bipolar Transistors (IGBTs) modules are hybrid semiconductor devices combining the high input impedance of MOSFETs with the low conduction losses of bipolar transistors. They serve as critical components in high-power switching applications, enabling efficient energy conversion in industrial, automotive, and consumer systems. Their ability to handle high voltage/current with fast switching characteristics makes them indispensable in modern power electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Standard IGBT Modules	General-purpose, balanced conduction/switching losses	Industrial motor drives, HVAC systems
High-Speed IGBTs	Optimized for switching frequencies >20kHz	Welding inverters, induction heating
Enhanced Dynamic IGBTs	Reduced tail current for lower switching losses	Electric vehicle (EV) on-board chargers
Trench IGBTs	Vertical trench gate structure for improved efficiency	Solar inverters, energy storage systems
Double-Sided Cooling Modules	Thermal management with cooling on both sides	High-power traction systems, wind turbines

3. Structure and Composition

IGBT modules typically consist of multiple IGBT dies and freewheeling diodes mounted on a ceramic substrate (usually Al₂O₃ or Si₃N₄). Key structural elements include:

Chip-level integration of IGBT and diode cells
DBC (Direct Bonded Copper) substrate for thermal conductivity
Thermoplastic/epoxy encapsulation for insulation
Aluminum wire bonds for die interconnection
Integrated temperature sensors in advanced modules

4. Key Technical Specifications

Parameter	Description	Importance
Rated Collector Current (I_C)	Maximum continuous operating current	Determines power handling capability
Breakdown Voltage (V_CE)	Max voltage before conduction	System voltage rating compatibility
Conduction Voltage Drop	Voltage loss during on-state	Impacts efficiency and thermal design
Switching Losses (E_on/E_off)	Energy loss during state transitions	Dictates maximum switching frequency
Operating Temperature Range	Valid junction temperature range	Reliability and lifespan factor
Isolation Voltage	Dielectric strength between layers	Safety compliance for high-voltage systems

5. Application Areas

Industrial: Motor drives, CNC machines, welding equipment
Automotive: EV traction inverters, PHEV battery management
Energy: Solar PV inverters, wind turbine converters
Consumer: High-end home appliances with variable speed drives
Rail: Traction systems for high-speed trains and metro networks

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Specifications
Infineon	FF600R12KE4	600A/1200V, 3-level topology, 175 C rating
ON Semiconductor	NVHL015AN	150A/1200V, automotive qualified
Mitsubishi Electric	CM400DY-34A	400A/1700V, double-sided cooling
Fuji Electric	2MBI150XAA120-50	150A/1200V, intelligent power module
STMicroelectronics	STGF8NC60KD	8A/600V, through-hole package

7. Selection Guidelines

Key considerations include:

Matching voltage/current ratings with system requirements
Switching frequency vs. conduction loss trade-off
Thermal management capabilities (R_th values)
Short-circuit withstand capability
Package dimensions and cooling interface compatibility
Functional safety requirements (e.g., ISO 26262 for automotive)

8. Industry Trends

Emerging trends include:

Transition to SiC/GaN hybrid modules for higher efficiency
Development of 3D packaging for reduced parasitic inductance
Integration of gate drivers and sensors in smart modules
Growing adoption in EV charging infrastructure (800V+ systems)
Advancements in sintering technology for die attach reliability