Transistors - IGBTs

Transistors - IGBTs - Modules

Part Number	Description / PDF	Quantity
FP75R12KT4PBPSA1 IR (Infineon Technologies)	IGBT MOD 1200V 150A 20MW	0
FS450R12OE4PBOSA1 IR (Infineon Technologies)	FS450R12 - IGBT MODULE	4
FZ3600R17HE4PHPSA1 IR (Infineon Technologies)	IGBT MODULE 1700V 7200A	0
FMG1G75US60L	IGBT, 75A, 600V, N-CHANNEL	52
FF300R12KE3HOSA1 IR (Infineon Technologies)	IGBT MOD 1200V 440A 1450W	16
A1P35S12M3 STMicroelectronics	IGBT MOD 1200V 35A 250W ACEPACK1	0
FF650R17IE4VBOSA1 IR (Infineon Technologies)	IGBT MODULE 1700V 4150W	0
APTGT150DA120G Roving Networks / Microchip Technology	IGBT MODULE 1200V 220A 690W SP6	0
FD1400R12IP4DBOSA1 IR (Infineon Technologies)	IGBT MOD 1200V 1400A 7700W	0
FF450R17ME4PBOSA1 IR (Infineon Technologies)	IGBT MOD 1700V 900A 20MW	0
FZ2400R12HP4HOSA2 IR (Infineon Technologies)	IGBT MODULE 1200V 3460A	2
APTGT75TL60T3G Roving Networks / Microchip Technology	IGBT MODULE 600V 100A 250W SP3	11
FF300R17KE3HOSA1 IR (Infineon Technologies)	IGBT MODULE 1700V 1450W	25
FZ800R33KL2CNOSA1 IR (Infineon Technologies)	IGBT MODULE	8
MG1250W-XBN2MM Wickmann / Littelfuse	IGBT MOD 1200V 75A 260W	0
FS35R12KT3BOSA1 IR (Infineon Technologies)	IGBT MOD 1200V 55A 210W	10
MG06400D-BN4MM Wickmann / Littelfuse	IGBT MODULE 600V 400A 1250W D3	0
FS50R06KE3BOSA1 IR (Infineon Technologies)	IGBT MODULE 600V 70A 190W	0
FZ2400R17HP4HOSA2 IR (Infineon Technologies)	FZ2400R17 - IGBT MODULE	0
FS20R06W1E3B11BOMA1 IR (Infineon Technologies)	IGBT MODULE 600V 35A 135W	0

Transistors - IGBTs - Modules

1. Overview

Insulated Gate Bipolar Transistors (IGBTs) modules are hybrid semiconductor devices combining the high input impedance of MOSFETs with the low conduction losses of bipolar transistors. They serve as critical components in high-power switching applications, enabling efficient energy conversion in industrial, automotive, and consumer systems. Their ability to handle high voltage/current with fast switching characteristics makes them indispensable in modern power electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Standard IGBT Modules	General-purpose, balanced conduction/switching losses	Industrial motor drives, HVAC systems
High-Speed IGBTs	Optimized for switching frequencies >20kHz	Welding inverters, induction heating
Enhanced Dynamic IGBTs	Reduced tail current for lower switching losses	Electric vehicle (EV) on-board chargers
Trench IGBTs	Vertical trench gate structure for improved efficiency	Solar inverters, energy storage systems
Double-Sided Cooling Modules	Thermal management with cooling on both sides	High-power traction systems, wind turbines

3. Structure and Composition

IGBT modules typically consist of multiple IGBT dies and freewheeling diodes mounted on a ceramic substrate (usually Al₂O₃ or Si₃N₄). Key structural elements include:

Chip-level integration of IGBT and diode cells
DBC (Direct Bonded Copper) substrate for thermal conductivity
Thermoplastic/epoxy encapsulation for insulation
Aluminum wire bonds for die interconnection
Integrated temperature sensors in advanced modules

4. Key Technical Specifications

Parameter	Description	Importance
Rated Collector Current (I_C)	Maximum continuous operating current	Determines power handling capability
Breakdown Voltage (V_CE)	Max voltage before conduction	System voltage rating compatibility
Conduction Voltage Drop	Voltage loss during on-state	Impacts efficiency and thermal design
Switching Losses (E_on/E_off)	Energy loss during state transitions	Dictates maximum switching frequency
Operating Temperature Range	Valid junction temperature range	Reliability and lifespan factor
Isolation Voltage	Dielectric strength between layers	Safety compliance for high-voltage systems

5. Application Areas

Industrial: Motor drives, CNC machines, welding equipment
Automotive: EV traction inverters, PHEV battery management
Energy: Solar PV inverters, wind turbine converters
Consumer: High-end home appliances with variable speed drives
Rail: Traction systems for high-speed trains and metro networks

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Specifications
Infineon	FF600R12KE4	600A/1200V, 3-level topology, 175 C rating
ON Semiconductor	NVHL015AN	150A/1200V, automotive qualified
Mitsubishi Electric	CM400DY-34A	400A/1700V, double-sided cooling
Fuji Electric	2MBI150XAA120-50	150A/1200V, intelligent power module
STMicroelectronics	STGF8NC60KD	8A/600V, through-hole package

7. Selection Guidelines

Key considerations include:

Matching voltage/current ratings with system requirements
Switching frequency vs. conduction loss trade-off
Thermal management capabilities (R_th values)
Short-circuit withstand capability
Package dimensions and cooling interface compatibility
Functional safety requirements (e.g., ISO 26262 for automotive)

8. Industry Trends

Emerging trends include:

Transition to SiC/GaN hybrid modules for higher efficiency
Development of 3D packaging for reduced parasitic inductance
Integration of gate drivers and sensors in smart modules
Growing adoption in EV charging infrastructure (800V+ systems)
Advancements in sintering technology for die attach reliability