Transistors - IGBTs

Transistors - IGBTs - Modules

Part Number	Description / PDF	Quantity
FP10R12W1T7B3BOMA1 IR (Infineon Technologies)	IGBT MODULE LOW POWER EASY	24
APTGT400A60D3G Roving Networks / Microchip Technology	IGBT MODULE 600V 500A 1250W D3	7
GSID150A120S6A4 SemiQ	IGBT MOD 1200V 275A 1035W	0
FF900R12IE4VBOSA1 IR (Infineon Technologies)	FF900R12 - IGBT MODULE	12
DDB6U75N16W1RBOMA1 IR (Infineon Technologies)	IGBT MOD 1200V 69A 335W	21
CPV364M4U Vishay General Semiconductor – Diodes Division	IGBT MODULE 600V 20A 63W IMS-2	0
APTGT75TDU120PG Roving Networks / Microchip Technology	IGBT MODULE 1200V 100A 350W SP6P	0
FS300R12KE4BOSA1 IR (Infineon Technologies)	IGBT MOD 1200V 450A 1600W	0
F450R07W1H3B11ABOMA1 IR (Infineon Technologies)	IGBT MODULES	0
FF300R07KE4HOSA1 IR (Infineon Technologies)	IGBT MODULE 650V 940W	10
FS150R17N3E4BOSA1 IR (Infineon Technologies)	IGBT MOD 1700V 150A 835W	0
FP35R12W2T4PBPSA1 IR (Infineon Technologies)	IGBT MOD 1200V 70A 20MW	14
APTGT100DU60TG Roving Networks / Microchip Technology	IGBT MODULE 600V 150A 340W SP4	0
FS770R08A6P2BBPSA1 IR (Infineon Technologies)	HYBRID PACK DRIVE	0
FS50R07N2E4 IR (Infineon Technologies)	IGBT MODULE	907
FMG2G400LS60	IGBT, 400A, 600V, N-CHANNEL	0
FS75R12KT4B15BOSA1 IR (Infineon Technologies)	IGBT MOD 1200V 75A 385W	12
FF400R12KE3B2HOSA1 IR (Infineon Technologies)	IGBT MOD 1200V 580A 2000W	0
FF600R17ME4PB11BOSA1 IR (Infineon Technologies)	IGBT MODULE VCES 600V 600A	0
DF300R12KE3HOSA1 IR (Infineon Technologies)	IGBT MOD 1200V 480A 1470W	0

Transistors - IGBTs - Modules

1. Overview

Insulated Gate Bipolar Transistors (IGBTs) modules are hybrid semiconductor devices combining the high input impedance of MOSFETs with the low conduction losses of bipolar transistors. They serve as critical components in high-power switching applications, enabling efficient energy conversion in industrial, automotive, and consumer systems. Their ability to handle high voltage/current with fast switching characteristics makes them indispensable in modern power electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Standard IGBT Modules	General-purpose, balanced conduction/switching losses	Industrial motor drives, HVAC systems
High-Speed IGBTs	Optimized for switching frequencies >20kHz	Welding inverters, induction heating
Enhanced Dynamic IGBTs	Reduced tail current for lower switching losses	Electric vehicle (EV) on-board chargers
Trench IGBTs	Vertical trench gate structure for improved efficiency	Solar inverters, energy storage systems
Double-Sided Cooling Modules	Thermal management with cooling on both sides	High-power traction systems, wind turbines

3. Structure and Composition

IGBT modules typically consist of multiple IGBT dies and freewheeling diodes mounted on a ceramic substrate (usually Al₂O₃ or Si₃N₄). Key structural elements include:

Chip-level integration of IGBT and diode cells
DBC (Direct Bonded Copper) substrate for thermal conductivity
Thermoplastic/epoxy encapsulation for insulation
Aluminum wire bonds for die interconnection
Integrated temperature sensors in advanced modules

4. Key Technical Specifications

Parameter	Description	Importance
Rated Collector Current (I_C)	Maximum continuous operating current	Determines power handling capability
Breakdown Voltage (V_CE)	Max voltage before conduction	System voltage rating compatibility
Conduction Voltage Drop	Voltage loss during on-state	Impacts efficiency and thermal design
Switching Losses (E_on/E_off)	Energy loss during state transitions	Dictates maximum switching frequency
Operating Temperature Range	Valid junction temperature range	Reliability and lifespan factor
Isolation Voltage	Dielectric strength between layers	Safety compliance for high-voltage systems

5. Application Areas

Industrial: Motor drives, CNC machines, welding equipment
Automotive: EV traction inverters, PHEV battery management
Energy: Solar PV inverters, wind turbine converters
Consumer: High-end home appliances with variable speed drives
Rail: Traction systems for high-speed trains and metro networks

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Specifications
Infineon	FF600R12KE4	600A/1200V, 3-level topology, 175 C rating
ON Semiconductor	NVHL015AN	150A/1200V, automotive qualified
Mitsubishi Electric	CM400DY-34A	400A/1700V, double-sided cooling
Fuji Electric	2MBI150XAA120-50	150A/1200V, intelligent power module
STMicroelectronics	STGF8NC60KD	8A/600V, through-hole package

7. Selection Guidelines

Key considerations include:

Matching voltage/current ratings with system requirements
Switching frequency vs. conduction loss trade-off
Thermal management capabilities (R_th values)
Short-circuit withstand capability
Package dimensions and cooling interface compatibility
Functional safety requirements (e.g., ISO 26262 for automotive)

8. Industry Trends

Emerging trends include:

Transition to SiC/GaN hybrid modules for higher efficiency
Development of 3D packaging for reduced parasitic inductance
Integration of gate drivers and sensors in smart modules
Growing adoption in EV charging infrastructure (800V+ systems)
Advancements in sintering technology for die attach reliability