Transistors - FETs, MOSFETs

Transistors - FETs, MOSFETs - Single

Part Number	Description / PDF	Quantity
RE1C001ZPTL ROHM Semiconductor	MOSFET P-CH 20V 100MA EMT3F	2405
R6030ENX ROHM Semiconductor	MOSFET N-CH 600V 30A TO220FM	497
RSR015P03TL ROHM Semiconductor	MOSFET P-CH 30V 1.5A TSMT3	78
TT8U1TR ROHM Semiconductor	MOSFET P-CH 20V 2.4A 8TSST	5177
RQ5C060BCTCL ROHM Semiconductor	MOSFET P-CHANNEL 20V 6A TSMT3	3614
RCX050N25 ROHM Semiconductor	MOSFET N-CH 250V 5A TO220FM	0
RW1A020ZPT2R ROHM Semiconductor	MOSFET P-CH 12V 2A WEMT6	6730
RUC002N05T116 ROHM Semiconductor	MOSFET N-CH 50V 200MA SST3	39358
RUR040N02TL ROHM Semiconductor	MOSFET N-CH 20V 4A TSMT3	7564
RSJ800N06TL ROHM Semiconductor	MOSFET N-CH 60V 80A LPTS	1990
RDD023N50TL ROHM Semiconductor	MOSFET N-CH 500V 2A CPT3	3
RQ5E025ATTCL ROHM Semiconductor	MOSFET P-CHANNEL 30V 2.5A TSMT3	3893
RK7002BT116 ROHM Semiconductor	MOSFET N-CH 60V 250MA SST3	0
RS1L145GNTB ROHM Semiconductor	MOSFET N-CH 60V 14.5A/47A 8HSOP	2220
RHU003N03FRAT106 ROHM Semiconductor	MOSFET N-CH 30V 300MA UMT3	1448
RTQ025P02TR ROHM Semiconductor	MOSFET P-CH 20V 2.5A TSMT6	0
RSH140N03TB1 ROHM Semiconductor	MOSFET N-CH 30V 14A 8SOP	0
2SK2094TL ROHM Semiconductor	MOSFET N-CH 60V 2A CPT3	0
RD3G500GNTL ROHM Semiconductor	MOSFET N-CH 40V 50A TO252	2445
RD3L050SNFRATL ROHM Semiconductor	MOSFET N-CH 60V 5A TO252	249

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Junction FET (JFET)	Voltage-controlled depletion mode operation, low noise	Low-noise amplifiers, analog switches
Enhancement Mode MOSFET	Normally-off device, requires positive V_GS to conduct	Power supplies, motor drives
Depletion Mode MOSFET	Normally-on device, requires negative V_GS to block	Radio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)	Combines MOSFET input with bipolar output, high current capacity	High-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO₂), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

Parameter	Description and Importance
V_DS (Drain-Source Voltage)	Maximum voltage rating between drain and source; determines breakdown tolerance
I_D (Drain Current)	Maximum continuous current capacity; critical for power handling
R_DS(on)	On-state resistance; impacts conduction losses and efficiency
V_GS(th) (Threshold Voltage)	Voltage required to form channel; determines control signal compatibility
Q_G (Gate Charge)	Charge required for switching; affects switching speed and driver requirements
P_D (Power Dissipation)	Maximum power handling capability; dictates thermal management needs

5. Application Fields

Consumer Electronics: Mobile phone chargers, notebook power adapters
Industrial: Motor drives, uninterruptible power supplies (UPS)
Automotive: Electric vehicle (EV) battery management systems, HEV inverters
Telecommunications: Base station power amplifiers, optical network transceivers
Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Texas Instruments	CSD18534Q5A	60V, 4.2m R_DS(on), automotive-grade
STMicroelectronics	STP55NF06	55A, 60V, high-speed switching
Infineon Technologies	IPB041N06N3	0.41 , 600V, TO-220 package
ON Semiconductor	NDS355AN	Depletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

Voltage and current requirements under operating conditions
Thermal performance (R_DS(on), package thermal resistance)
Switching speed vs. conduction loss trade-off
Gate drive compatibility with control circuitry
Environmental factors (temperature, vibration, humidity)
Cost-performance balance for volume production

8. Industry Trends

Current trends include:

Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
Advanced packaging technologies (double-sided cooling, copper clip)
Integration with gate drivers and protection circuits
Miniaturization through trench and shielded gate structures
Development of automotive-qualified devices for EVs and ADAS