Transistors - FETs, MOSFETs

Transistors - FETs, MOSFETs - Single

Part Number	Description / PDF	Quantity
RTF020P02TL ROHM Semiconductor	MOSFET P-CH 20V 2A TUMT3	954
R6015FNJTL ROHM Semiconductor	MOSFET N-CH 600V 15A LPT	980
R8010ANX ROHM Semiconductor	MOSFET N-CH 800V 10A TO220FM	0
ES6U42T2R ROHM Semiconductor	MOSFET P-CH 20V 1A 6WEMT	0
RW1A030APT2CR ROHM Semiconductor	MOSFET P-CH 12V 3A 6WEMT	1483
RQ6L035ATTCR ROHM Semiconductor	PCH -60V -3.5A POWER MOSFET - RQ	30
RF4E060AJTCR ROHM Semiconductor	MOSFET N-CH 30V 6A HUML2020L8	2950
R6007ENJTL ROHM Semiconductor	MOSFET N-CH 600V 7A LPTS	660
RTQ035N03TR ROHM Semiconductor	MOSFET N-CH 30V 3.5A TSMT6	3824
RDD020N60TL ROHM Semiconductor	MOSFET N-CH 600V 2A CPT3	0
RV3C002UNT2CL ROHM Semiconductor	MOSFET N-CH 20V 150MA VML0604	55729
QS5U33TR ROHM Semiconductor	MOSFET P-CH 30V 2A TSMT5	0
RHU002N06FRAT106 ROHM Semiconductor	MOSFET N-CH 60V 200MA UMT3	2537
US5U30TR ROHM Semiconductor	MOSFET P-CH 20V 1A TUMT5	0
R6520KNJTL ROHM Semiconductor	MOSFET N-CH 650V 20A LPTS	98
2SK2103T100 ROHM Semiconductor	MOSFET N-CH 30V 2A MPT3	1000
R6524ENJTL ROHM Semiconductor	MOSFET N-CH 650V 24A LPTS	100
BSM400C12P3G202 ROHM Semiconductor	SICFET N-CH 1200V 400A MODULE	1
SCT3080ARC14 ROHM Semiconductor	SICFET N-CH 650V 30A TO247-4L	232
ES6U41T2R ROHM Semiconductor	MOSFET N-CH 30V 1.5A 6WEMT	0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Junction FET (JFET)	Voltage-controlled depletion mode operation, low noise	Low-noise amplifiers, analog switches
Enhancement Mode MOSFET	Normally-off device, requires positive V_GS to conduct	Power supplies, motor drives
Depletion Mode MOSFET	Normally-on device, requires negative V_GS to block	Radio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)	Combines MOSFET input with bipolar output, high current capacity	High-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO₂), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

Parameter	Description and Importance
V_DS (Drain-Source Voltage)	Maximum voltage rating between drain and source; determines breakdown tolerance
I_D (Drain Current)	Maximum continuous current capacity; critical for power handling
R_DS(on)	On-state resistance; impacts conduction losses and efficiency
V_GS(th) (Threshold Voltage)	Voltage required to form channel; determines control signal compatibility
Q_G (Gate Charge)	Charge required for switching; affects switching speed and driver requirements
P_D (Power Dissipation)	Maximum power handling capability; dictates thermal management needs

5. Application Fields

Consumer Electronics: Mobile phone chargers, notebook power adapters
Industrial: Motor drives, uninterruptible power supplies (UPS)
Automotive: Electric vehicle (EV) battery management systems, HEV inverters
Telecommunications: Base station power amplifiers, optical network transceivers
Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Texas Instruments	CSD18534Q5A	60V, 4.2m R_DS(on), automotive-grade
STMicroelectronics	STP55NF06	55A, 60V, high-speed switching
Infineon Technologies	IPB041N06N3	0.41 , 600V, TO-220 package
ON Semiconductor	NDS355AN	Depletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

Voltage and current requirements under operating conditions
Thermal performance (R_DS(on), package thermal resistance)
Switching speed vs. conduction loss trade-off
Gate drive compatibility with control circuitry
Environmental factors (temperature, vibration, humidity)
Cost-performance balance for volume production

8. Industry Trends

Current trends include:

Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
Advanced packaging technologies (double-sided cooling, copper clip)
Integration with gate drivers and protection circuits
Miniaturization through trench and shielded gate structures
Development of automotive-qualified devices for EVs and ADAS