Transistors - FETs, MOSFETs

Transistors - FETs, MOSFETs - Single

Part Number	Description / PDF	Quantity
R6007KNX ROHM Semiconductor	MOSFET N-CH 600V 7A TO220FM	474
R6509KNJTL ROHM Semiconductor	MOSFET N-CH 650V 9A LPTS	94
RCD075N20TL ROHM Semiconductor	MOSFET N-CH 200V 7.5A CPT3	0
RS1E130GNTB ROHM Semiconductor	MOSFET N-CH 30V 13A 8HSOP	2243
R6076MNZ1C9 ROHM Semiconductor	MOSFET N-CHANNEL 600V 76A TO247	435
QS5U27TR ROHM Semiconductor	MOSFET P-CH 20V 1.5A TSMT5	2110
RF6E045AJTCR ROHM Semiconductor	MOSFET N-CHANNEL 30V 4.5A TUMT6	1428
R6030ENZ1C9 ROHM Semiconductor	MOSFET N-CH 600V 30A TO247	93
R6007END3TL1 ROHM Semiconductor	MOSFET N-CH 600V 7A TO252	38
RMW280N03TB ROHM Semiconductor	MOSFET N-CH 30V 28A 8PSOP	20
RTR025N05TL ROHM Semiconductor	MOSFET N-CH 45V 2.5A TSMT3	8765
R6020ENX ROHM Semiconductor	MOSFET N-CH 600V 20A TO220FM	285
RRH100P03GZETB ROHM Semiconductor	MOSFET P-CH 30V 10A 8SOP	2694
R6018ANJTL ROHM Semiconductor	MOSFET N-CH 600V 18A LPTS	0
RYE002N05TCL ROHM Semiconductor	MOSFET N-CH 50V 200MA EMT3	2500
R6025JNZ4C13 ROHM Semiconductor	MOSFET N-CH 600V 25A TO247G	630
SCT2160KEC ROHM Semiconductor	SICFET N-CH 1200V 22A TO247	4385
RTR025N03HZGTL ROHM Semiconductor	MOSFET N-CH 30V 2.5A TSMT3	63
RV8C010UNHZGG2CR ROHM Semiconductor	MOSFET N-CH 20V 1A DFN1010-3W	0
SCT3040KLGC11 ROHM Semiconductor	SICFET N-CH 1200V 55A TO247N	2217

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Junction FET (JFET)	Voltage-controlled depletion mode operation, low noise	Low-noise amplifiers, analog switches
Enhancement Mode MOSFET	Normally-off device, requires positive V_GS to conduct	Power supplies, motor drives
Depletion Mode MOSFET	Normally-on device, requires negative V_GS to block	Radio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)	Combines MOSFET input with bipolar output, high current capacity	High-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO₂), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

Parameter	Description and Importance
V_DS (Drain-Source Voltage)	Maximum voltage rating between drain and source; determines breakdown tolerance
I_D (Drain Current)	Maximum continuous current capacity; critical for power handling
R_DS(on)	On-state resistance; impacts conduction losses and efficiency
V_GS(th) (Threshold Voltage)	Voltage required to form channel; determines control signal compatibility
Q_G (Gate Charge)	Charge required for switching; affects switching speed and driver requirements
P_D (Power Dissipation)	Maximum power handling capability; dictates thermal management needs

5. Application Fields

Consumer Electronics: Mobile phone chargers, notebook power adapters
Industrial: Motor drives, uninterruptible power supplies (UPS)
Automotive: Electric vehicle (EV) battery management systems, HEV inverters
Telecommunications: Base station power amplifiers, optical network transceivers
Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Texas Instruments	CSD18534Q5A	60V, 4.2m R_DS(on), automotive-grade
STMicroelectronics	STP55NF06	55A, 60V, high-speed switching
Infineon Technologies	IPB041N06N3	0.41 , 600V, TO-220 package
ON Semiconductor	NDS355AN	Depletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

Voltage and current requirements under operating conditions
Thermal performance (R_DS(on), package thermal resistance)
Switching speed vs. conduction loss trade-off
Gate drive compatibility with control circuitry
Environmental factors (temperature, vibration, humidity)
Cost-performance balance for volume production

8. Industry Trends

Current trends include:

Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
Advanced packaging technologies (double-sided cooling, copper clip)
Integration with gate drivers and protection circuits
Miniaturization through trench and shielded gate structures
Development of automotive-qualified devices for EVs and ADAS