Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
IRFIZ48NPBF

IRFIZ48NPBF

IR (Infineon Technologies)

HEXFET POWER MOSFET

8155

IPP50R280CEXKSA1

IPP50R280CEXKSA1

IR (Infineon Technologies)

MOSFET N-CH 500V 13A TO220-3

365

IRL2505PBF

IRL2505PBF

IR (Infineon Technologies)

MOSFET N-CH 55V 104A TO220AB

4387

IRLH6224TRPBF

IRLH6224TRPBF

IR (Infineon Technologies)

MOSFET N-CH 20V 28A/105A 8PQFN

7660

IPW65R190E6FKSA1

IPW65R190E6FKSA1

IR (Infineon Technologies)

MOSFET N-CH 650V 20.2A TO247-3

5280

AUIRF4905L

AUIRF4905L

IR (Infineon Technologies)

AUTOMOTIVE HEXFET P CHANNEL

1081

IRFR3411PBF

IRFR3411PBF

IR (Infineon Technologies)

MOSFET N-CH 100V 32A DPAK

0

IRFP3710PBF

IRFP3710PBF

IR (Infineon Technologies)

MOSFET N-CH 100V 57A TO247AC

4

IPI80P03P4-05AKSA1

IPI80P03P4-05AKSA1

IR (Infineon Technologies)

P-CHANNEL POWER MOSFET

12703

SPP73N03S2L-08

SPP73N03S2L-08

IR (Infineon Technologies)

N-CHANNEL POWER MOSFET

0

IPB65R310CFDATMA1

IPB65R310CFDATMA1

IR (Infineon Technologies)

MOSFET N-CH 650V 11.4A D2PAK

12520

IPB65R310CFDATMA2

IPB65R310CFDATMA2

IR (Infineon Technologies)

MOSFET N-CH 650V 11.4A TO263-3

0

IRFR1018EPBF-INF

IRFR1018EPBF-INF

IR (Infineon Technologies)

HEXFET POWER MOSFET

0

IRF3808SPBF

IRF3808SPBF

IR (Infineon Technologies)

HEXFET POWER MOSFET

0

BSC034N03LSGATMA1

BSC034N03LSGATMA1

IR (Infineon Technologies)

MOSFET N-CH 30V 22A/100A TDSON

5000

IPI120N04S402AKSA1

IPI120N04S402AKSA1

IR (Infineon Technologies)

MOSFET N-CH 40V 120A TO262-3

1116

IPA65R310CFDXKSA2

IPA65R310CFDXKSA2

IR (Infineon Technologies)

MOSFET N-CH 650V 11.4A TO220

0

BSZ010NE2LS5ATMA1

BSZ010NE2LS5ATMA1

IR (Infineon Technologies)

MOSFET N-CH 25V 32A/40A TSDSON

3998

IRFH8318TRPBF

IRFH8318TRPBF

IR (Infineon Technologies)

MOSFET N-CH 30V 27A/120A PQFN

0

IPLK60R600PFD7ATMA1

IPLK60R600PFD7ATMA1

IR (Infineon Technologies)

MOSFET N-CH 600V 7A THIN-PAK

4990

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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