Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
IXTP32P20T

IXTP32P20T

Wickmann / Littelfuse

MOSFET P-CH 200V 32A TO220AB

290

IXFT44N50P

IXFT44N50P

Wickmann / Littelfuse

MOSFET N-CH 500V 44A TO268

1621110

IXTA05N100HV

IXTA05N100HV

Wickmann / Littelfuse

MOSFET N-CH 1000V 750MA TO263

800

IXTK102N65X2

IXTK102N65X2

Wickmann / Littelfuse

MOSFET N-CH 650V 102A TO264

50325

IXFH50N50P3

IXFH50N50P3

Wickmann / Littelfuse

MOSFET N-CH 500V 50A TO247AD

0

IXTT90P10P

IXTT90P10P

Wickmann / Littelfuse

MOSFET P-CH 100V 90A TO268

146390

IXFR64N50P

IXFR64N50P

Wickmann / Littelfuse

MOSFET N-CH 500V 35A ISOPLUS247

17540

IXFH88N30P

IXFH88N30P

Wickmann / Littelfuse

MOSFET N-CH 300V 88A TO247AD

331020

IXTA02N250HV-TRL

IXTA02N250HV-TRL

Wickmann / Littelfuse

MOSFET N-CH 2500V 200MA TO263HV

800

IXTP340N04T4

IXTP340N04T4

Wickmann / Littelfuse

MOSFET N-CH 40V 340A TO220AB

1050

IXFA34N65X2

IXFA34N65X2

Wickmann / Littelfuse

MOSFET N-CH 650V 34A TO263AA

265

IXTA26P20P-TRL

IXTA26P20P-TRL

Wickmann / Littelfuse

MOSFET P-CH 200V 26A TO263

0

IXTP100N04T2

IXTP100N04T2

Wickmann / Littelfuse

MOSFET N-CH 40V 100A TO220AB

122

IXFK80N50Q3

IXFK80N50Q3

Wickmann / Littelfuse

MOSFET N-CH 500V 80A TO264AA

675

IXFH170N10P

IXFH170N10P

Wickmann / Littelfuse

MOSFET N-CH 100V 170A TO247AD

0

IXTN200N10T

IXTN200N10T

Wickmann / Littelfuse

MOSFET N-CH 100V 200A SOT227B

1210

IXTR120P20T

IXTR120P20T

Wickmann / Littelfuse

MOSFET P-CH 200V 90A ISOPLUS247

210

IXFK230N20T

IXFK230N20T

Wickmann / Littelfuse

MOSFET N-CH 200V 230A TO264AA

487

IXFB70N100X

IXFB70N100X

Wickmann / Littelfuse

MOSFET N-CH 1000V 70A PLUS264

54

IXFT80N65X2HV

IXFT80N65X2HV

Wickmann / Littelfuse

MOSFET N-CH 650V 80A TO268HV

780

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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