Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
IXFH30N85X

IXFH30N85X

Wickmann / Littelfuse

MOSFET N-CH 850V 30A TO247AD

14

IXFX94N50P2

IXFX94N50P2

Wickmann / Littelfuse

MOSFET N-CH 500V 94A PLUS247-3

74840

IXFT42N50P2

IXFT42N50P2

Wickmann / Littelfuse

MOSFET N-CH 500V 42A TO268

0

IXFP102N15T

IXFP102N15T

Wickmann / Littelfuse

MOSFET N-CH 150V 102A TO220AB

1150

IXFX66N85X

IXFX66N85X

Wickmann / Littelfuse

MOSFET N-CH 850V 66A PLUS247-3

8360

IXTA42N15T

IXTA42N15T

Wickmann / Littelfuse

MOSFET N-CH 150V 42A TO263

1100

IXKK85N60C

IXKK85N60C

Wickmann / Littelfuse

MOSFET N-CH 600V 85A TO264A

0

IXFX210N30X3

IXFX210N30X3

Wickmann / Littelfuse

MOSFET N-CH 300V 210A PLUS247-3

82

IXFN20N120P

IXFN20N120P

Wickmann / Littelfuse

MOSFET N-CH 1200V 20A SOT-227B

500

IXFN50N80Q2

IXFN50N80Q2

Wickmann / Littelfuse

MOSFET N-CH 800V 50A SOT-227B

0

IXFA36N20X3

IXFA36N20X3

Wickmann / Littelfuse

MOSFET N-CH 200V 36A TO263AA

1700

IXKT70N60C5-TUB

IXKT70N60C5-TUB

Wickmann / Littelfuse

MOSFET N-CH 600V 68A TO268

0

IXTA48P05T-TRL

IXTA48P05T-TRL

Wickmann / Littelfuse

MOSFET P-CH 50V 48A TO263

0

IXFK26N100P

IXFK26N100P

Wickmann / Littelfuse

MOSFET N-CH 1000V 26A TO264AA

0

MMIX1T132N50P3

MMIX1T132N50P3

Wickmann / Littelfuse

MOSFET N-CH 500V 63A POLAR3

0

IXTH76N25T

IXTH76N25T

Wickmann / Littelfuse

MOSFET N-CH 250V 76A TO247

14900

IXFT120N25X3HV

IXFT120N25X3HV

Wickmann / Littelfuse

MOSFET N-CH 250V 120A TO268HV

2039420

IXTH2N150L

IXTH2N150L

Wickmann / Littelfuse

MOSFET N-CH 1500V 2A TO247

0

IXFH74N20P

IXFH74N20P

Wickmann / Littelfuse

MOSFET N-CH 200V 74A TO247AD

0

IXFT140N20X3HV

IXFT140N20X3HV

Wickmann / Littelfuse

MOSFET N-CH 200V 140A TO268HV

870

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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