Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
IXTA270N04T4-7

IXTA270N04T4-7

Wickmann / Littelfuse

MOSFET N-CH 40V 270A TO263-7

0

IXTT75N10

IXTT75N10

Wickmann / Littelfuse

MOSFET N-CH 100V 75A TO268

0

IXTP2N100

IXTP2N100

Wickmann / Littelfuse

MOSFET N-CH 1000V 2A TO220AB

2300

IXFT24N80P

IXFT24N80P

Wickmann / Littelfuse

MOSFET N-CH 800V 24A TO268

0

IXFT15N100Q3

IXFT15N100Q3

Wickmann / Littelfuse

MOSFET N-CH 1000V 15A TO268

0

IXTT36N50P

IXTT36N50P

Wickmann / Littelfuse

MOSFET N-CH 500V 36A TO268

0

IXFR80N50P

IXFR80N50P

Wickmann / Littelfuse

MOSFET N-CH 500V 45A ISOPLUS247

102150

IXFR32N100Q3

IXFR32N100Q3

Wickmann / Littelfuse

MOSFET N-CH 1000V 23A ISOPLUS247

0

IXTH10P60

IXTH10P60

Wickmann / Littelfuse

MOSFET P-CH 600V 10A TO247

316570

IXFX150N30P3

IXFX150N30P3

Wickmann / Littelfuse

MOSFET N-CH 300V 150A PLUS247-3

1050

IXFP14N60P

IXFP14N60P

Wickmann / Littelfuse

MOSFET N-CH 600V 14A TO220AB

0

IXTX102N65X2

IXTX102N65X2

Wickmann / Littelfuse

MOSFET N-CH 650V 102A PLUS247-3

7

IXTA08N120P

IXTA08N120P

Wickmann / Littelfuse

MOSFET N-CH 1200V 800MA TO263

600

IXFA130N10T2-TRL

IXFA130N10T2-TRL

Wickmann / Littelfuse

MOSFET N-CH 100V 130A TO263

0

IXFH12N90P

IXFH12N90P

Wickmann / Littelfuse

MOSFET N-CH 900V 12A TO247AD

290

IXTY08N100D2

IXTY08N100D2

Wickmann / Littelfuse

MOSFET N-CH 1000V 800MA TO252

0

IXFP36N30P3

IXFP36N30P3

Wickmann / Littelfuse

MOSFET N-CH 300V 36A TO220AB

850

IXFH40N85X

IXFH40N85X

Wickmann / Littelfuse

MOSFET N-CH 850V 40A TO247

166

IXFK150N30P3

IXFK150N30P3

Wickmann / Littelfuse

MOSFET N-CH 300V 150A TO264AA

1125

IXTH140N075L2

IXTH140N075L2

Wickmann / Littelfuse

MOSFET N-CH 75V 140A TO247

390

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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