Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
IXKR47N60C5

IXKR47N60C5

Wickmann / Littelfuse

MOSFET N-CH 600V 47A ISOPLUS247

0

IXTP80N075L2

IXTP80N075L2

Wickmann / Littelfuse

MOSFET N-CH 75V 80A TO220AB

350

IXTA6N100D2HV

IXTA6N100D2HV

Wickmann / Littelfuse

MOSFET N-CH 1000V 6A TO263HV

1100

IXTH24P20

IXTH24P20

Wickmann / Littelfuse

MOSFET P-CH 200V 24A TO247

330

IXTP08N120P

IXTP08N120P

Wickmann / Littelfuse

MOSFET N-CH 1200V 800MA TO220AB

2700

IXTA130N10T7

IXTA130N10T7

Wickmann / Littelfuse

MOSFET N-CH 100V 130A TO263

900

IXFK210N30X3

IXFK210N30X3

Wickmann / Littelfuse

MOSFET N-CH 300V 210A TO264

97

IXFP18N65X2

IXFP18N65X2

Wickmann / Littelfuse

MOSFET N-CH 650V 18A TO220AB

1500

IXFT70N30Q3

IXFT70N30Q3

Wickmann / Littelfuse

MOSFET N-CH 300V 70A TO268

900

IXFN44N80P

IXFN44N80P

Wickmann / Littelfuse

MOSFET N-CH 800V 39A SOT-227B

3260

IXTA16N50P

IXTA16N50P

Wickmann / Littelfuse

MOSFET N-CH 500V 16A TO263

350

IXFH94N30T

IXFH94N30T

Wickmann / Littelfuse

MOSFET N-CH 300V 94A TO247AD

2340

IXTP34N65X2

IXTP34N65X2

Wickmann / Littelfuse

MOSFET N-CH 650V 34A TO220AB

291950

IXFH270N06T3

IXFH270N06T3

Wickmann / Littelfuse

MOSFET N-CH 60V 270A TO247

110150

CPC3902ZTR

CPC3902ZTR

Wickmann / Littelfuse

MOSFET N-CH 250V SOT223

1000

IXTH3N100P

IXTH3N100P

Wickmann / Littelfuse

MOSFET N-CH 1000V 3A TO247

900

IXFP72N30X3M

IXFP72N30X3M

Wickmann / Littelfuse

MOSFET N-CH 300V 72A TO220

255750

IXTP52P10P

IXTP52P10P

Wickmann / Littelfuse

MOSFET P-CH 100V 52A TO220AB

125

IXTQ16N50P

IXTQ16N50P

Wickmann / Littelfuse

MOSFET N-CH 500V 16A TO3P

29900

IXTP42N15T

IXTP42N15T

Wickmann / Littelfuse

MOSFET N-CH 150V 42A TO220AB

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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