Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
PMXB75UPE/M5147

PMXB75UPE/M5147

NXP Semiconductors

P-CHANNEL MOSFET

45000

PMXB350UPE147

PMXB350UPE147

NXP Semiconductors

SMALL SIGNAL FET

0

PSMN1RS-40ES127

PSMN1RS-40ES127

NXP Semiconductors

N-CHANNEL POWER MOSFET

0

PMXB56EN147

PMXB56EN147

NXP Semiconductors

SMALL SIGNAL FET

0

BUK653R5-55C

BUK653R5-55C

NXP Semiconductors

N-CHANNEL POWER MOSFET

0

BUK7E5R2-100E,127-NXP

BUK7E5R2-100E,127-NXP

NXP Semiconductors

PFET, 120A I(D), 100V, 0.0052OHM

0

NX7002BKXB147

NX7002BKXB147

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

1660000

PSMN7R5-30YLD115

PSMN7R5-30YLD115

NXP Semiconductors

N-CHANNEL POWER MOSFET

0

PH9130AL115

PH9130AL115

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

511500

PHM10030DLS115

PHM10030DLS115

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

24000

BUK7905-40AI127

BUK7905-40AI127

NXP Semiconductors

N-CHANNEL POWER MOSFET

0

BSS84AKW-B115

BSS84AKW-B115

NXP Semiconductors

P-CHANNEL MOSFET

231000

PMZ1200UPE315

PMZ1200UPE315

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

0

PH4030AL115

PH4030AL115

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

0

PMDXB550UNE/S500147

PMDXB550UNE/S500147

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

60000

BUK7506-55A127

BUK7506-55A127

NXP Semiconductors

N-CHANNEL POWER MOSFET

0

PMXB75UPE147

PMXB75UPE147

NXP Semiconductors

P-CHANNEL MOSFET

4340000

ON5275/C1135

ON5275/C1135

NXP Semiconductors

MOSFET RF, SOT223

0

NX2020P1115

NX2020P1115

NXP Semiconductors

POWER FIELD-EFFECT TRANSISTOR

262000

PH3530DL115

PH3530DL115

NXP Semiconductors

POWER TRANSISTOR, MOSFET

24000

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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