Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
BUK9514-55A,127

BUK9514-55A,127

NXP Semiconductors

PFET, 73A I(D), 55V, 0.015OHM, 1

7857

PMG85XP125

PMG85XP125

NXP Semiconductors

P-CHANNEL MOSFET

0

PMT200EPEA115

PMT200EPEA115

NXP Semiconductors

P-CHANNEL MOSFET

205000

BUK7C10-75AITE,118

BUK7C10-75AITE,118

NXP Semiconductors

MOSFET N-CH 75V 75A D2PAK

0

BUK7628-55A/C1118

BUK7628-55A/C1118

NXP Semiconductors

N-CHANNEL POWER MOSFET

1600

BUK7520-100A,127

BUK7520-100A,127

NXP Semiconductors

PFET, 63A I(D), 100V, 0.02OHM, 1

0

BUK6217-55C,118

BUK6217-55C,118

NXP Semiconductors

MOSFET N-CH 55V 44A DPAK

5921

PSMN6R0-25YLD115

PSMN6R0-25YLD115

NXP Semiconductors

N-CHANNEL POWER MOSFET

43500

PMPB20UN,115

PMPB20UN,115

NXP Semiconductors

MOSFET N-CH 20V 6.6A 6DFN

108000

BUK954R8-60E,127

BUK954R8-60E,127

NXP Semiconductors

MOSFET N-CH 60V 100A TO220AB

1572

PSMN2R6-60PSQ127

PSMN2R6-60PSQ127

NXP Semiconductors

MOSFET N-CH 60V 150A TO220AB

0

PH3120L,115

PH3120L,115

NXP Semiconductors

POWER FIELD-EFFECT TRANSISTOR, 1

0

BUK9635-100A-118

BUK9635-100A-118

NXP Semiconductors

N-CHANNEL POWER MOSFET

0

PMN27XPE115

PMN27XPE115

NXP Semiconductors

SMALL SIGNAL FET

57000

BUK9540-100A,127

BUK9540-100A,127

NXP Semiconductors

MOSFET N-CH 100V 39A TO220AB

0

PMN50UPE,115

PMN50UPE,115

NXP Semiconductors

MOSFET P-CH 20V 3.6A 6TSOP

22817

PMGD290UCEA/DG/B2115

PMGD290UCEA/DG/B2115

NXP Semiconductors

P-CHANNEL MOSFET

0

PSMN9RO-25YLC115

PSMN9RO-25YLC115

NXP Semiconductors

N-CHANNEL POWER MOSFET

0

PH2230DLS115

PH2230DLS115

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

7500

PMCXB900UEL147

PMCXB900UEL147

NXP Semiconductors

P-CHANNEL MOSFET

30000

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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