Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
PH3830L,115

PH3830L,115

NXP Semiconductors

MOSFET N-CH 30V 98A LFPAK56

0

NX3008PBK/DG/B2215

NX3008PBK/DG/B2215

NXP Semiconductors

P-CHANNEL MOSFET

100000

BUK751R6-30E,127

BUK751R6-30E,127

NXP Semiconductors

MOSFET N-CH 30V 120A TO220AB

277

PMN55LN,135

PMN55LN,135

NXP Semiconductors

MOSFET N-CH 20V 4.1A 6TSOP

0

BUK7535-55A,127

BUK7535-55A,127

NXP Semiconductors

PFET, 35A I(D), 55V, 0.035OHM, 1

0

BUK7Y153-100E115

BUK7Y153-100E115

NXP Semiconductors

N-CHANNEL POWER MOSFET

84000

BUK9535-55A127

BUK9535-55A127

NXP Semiconductors

N-CHANNEL POWER MOSFET

0

BUK753R8-80E,127

BUK753R8-80E,127

NXP Semiconductors

TRANSISTOR >30MHZ

3749

PHB110NQ08T,118

PHB110NQ08T,118

NXP Semiconductors

MOSFET N-CH 75V 75A D2PAK

750

PSMN1R5-30BLE118

PSMN1R5-30BLE118

NXP Semiconductors

N-CHANNEL POWER MOSFET

2941

BUK7C06-40AITE,118

BUK7C06-40AITE,118

NXP Semiconductors

MOSFET N-CH 40V 75A D2PAK

3200

PMV65XP1215

PMV65XP1215

NXP Semiconductors

P-CHANNEL MOSFET

12000

BSS84AK/DG/B2215

BSS84AK/DG/B2215

NXP Semiconductors

P-CHANNEL MOSFET

36000

BUK7226-75A118

BUK7226-75A118

NXP Semiconductors

N-CHANNEL POWER MOSFET

24044

PMN48XP,125

PMN48XP,125

NXP Semiconductors

MOSFET P-CH 20V 4.1A 6TSOP

0

BUK6228-55C,118

BUK6228-55C,118

NXP Semiconductors

PFET, 31A I(D), 55V, 0.044OHM, 1

5615

PSMN8R5-108ES127

PSMN8R5-108ES127

NXP Semiconductors

N-CHANNEL POWER MOSFET

0

BUK9E2R8-60E,127

BUK9E2R8-60E,127

NXP Semiconductors

MOSFET N-CH 60V 120A I2PAK

288

BUK7528-55A,127

BUK7528-55A,127

NXP Semiconductors

PFET, 42A I(D), 55V, 0.028OHM, 1

4285

PMF63UNE115

PMF63UNE115

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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