Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
PMV16UN,215

PMV16UN,215

NXP Semiconductors

SMALL SIGNAL FIELD-EFFECT TRANSI

317696

BUK7880-55,135

BUK7880-55,135

NXP Semiconductors

MOSFET N-CH 55V 3.5A SOT223

55710

PMN27UP,115-NXP

PMN27UP,115-NXP

NXP Semiconductors

MOSFET P-CH 20V 5.7A 6TSOP

0

PMV50XP215

PMV50XP215

NXP Semiconductors

P-CHANNEL MOSFET

2289000

PSMN016-100XS,127

PSMN016-100XS,127

NXP Semiconductors

MOSFET N-CH 100V 32.1A TO220F

0

BUK7E1R6-30E,127

BUK7E1R6-30E,127

NXP Semiconductors

MOSFET N-CH 30V 120A I2PAK

295

BUK654R0-75C,127

BUK654R0-75C,127

NXP Semiconductors

PFET, 120A I(D), 75V, 0.006OHM,

4883

PMV28UN,215

PMV28UN,215

NXP Semiconductors

SMALL SIGNAL FIELD-EFFECT TRANSI

16611

PMV65XPE215

PMV65XPE215

NXP Semiconductors

P-CHANNEL MOSFET

1887000

BUK754R3-40B,127

BUK754R3-40B,127

NXP Semiconductors

PFET, 75A I(D), 40V, 0.0043OHM,

900

PSMN1R9-40PL127

PSMN1R9-40PL127

NXP Semiconductors

N-CHANNEL POWER MOSFET

2255

PMN34LN,135

PMN34LN,135

NXP Semiconductors

MOSFET N-CH 20V 5.7A 6TSOP

10173

PSMN6R1-30YLD115

PSMN6R1-30YLD115

NXP Semiconductors

N-CHANNEL POWER MOSFET

0

BUK7Y54-75B,115

BUK7Y54-75B,115

NXP Semiconductors

PFET, 21.4A I(D), 75V, 0.054OHM,

0

PSMN5R6-100XS,127

PSMN5R6-100XS,127

NXP Semiconductors

MOSFET N-CH 100V 61.8A TO220F

894

BUK9E04-40A,127

BUK9E04-40A,127

NXP Semiconductors

MOSFET N-CH 40V 75A I2PAK

0

PMZB380XN,315

PMZB380XN,315

NXP Semiconductors

MOSFET N-CH 30V 930MA DFN1006B-3

246549

PMPB33XN,115

PMPB33XN,115

NXP Semiconductors

MOSFET N-CH 30V 4.3A DFN2020MD-6

244326

BSP225/S911115

BSP225/S911115

NXP Semiconductors

P-CHANNEL MOSFET

0

PMF250XN,115

PMF250XN,115

NXP Semiconductors

SMALL SIGNAL FIELD-EFFECT TRANSI

11980

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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