Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
PMXB120EPE147

PMXB120EPE147

NXP Semiconductors

SMALL SIGNAL FET

822324

PMCXB900UE147

PMCXB900UE147

NXP Semiconductors

SMALL SIGNAL FET

0

ON5452518

ON5452518

NXP Semiconductors

NOW NEXPERIA ON5452 - RF MOSFET

0

PMXB360ENEA147

PMXB360ENEA147

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

0

PMDXB950UPEL147

PMDXB950UPEL147

NXP Semiconductors

SMALL SIGNAL FET

0

ON5258215

ON5258215

NXP Semiconductors

NOW NEXPERIA ON5258 - RF MOSFET

696000

ON5441518

ON5441518

NXP Semiconductors

NOW NEXPERIA ON5441 - RF MOSFET

32000

NX602NBKS115

NX602NBKS115

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

0

BUK7E2R3-40E,127-NXP

BUK7E2R3-40E,127-NXP

NXP Semiconductors

PFET, 120A I(D), 40V, 0.0023OHM,

0

BUK78150-55A115

BUK78150-55A115

NXP Semiconductors

N-CHANNEL POWER MOSFET

0

NX2020N2115

NX2020N2115

NXP Semiconductors

POWER FIELD-EFFECT TRANSISTOR

255000

PMDXB950UPE147

PMDXB950UPE147

NXP Semiconductors

SMALL SIGNAL FET

0

PMDPB760EN115

PMDPB760EN115

NXP Semiconductors

SMALL SIGNAL FET

9000

PMK50XP518

PMK50XP518

NXP Semiconductors

P-CHANNEL POWER MOSFET

0

PSMN2R4-30MLD115

PSMN2R4-30MLD115

NXP Semiconductors

N-CHANNEL POWER MOSFET

0

BSS84AKW/DG/B2215

BSS84AKW/DG/B2215

NXP Semiconductors

P-CHANNEL MOSFET

81000

BUK662R7-55C

BUK662R7-55C

NXP Semiconductors

NOW NEXPERIA BUK662R7-55C - POWE

0

PMCXB1000UE147

PMCXB1000UE147

NXP Semiconductors

P-CHANNEL MOSFET

235000

BUK6C2R1-55C,118-NX

BUK6C2R1-55C,118-NX

NXP Semiconductors

PFET, 228A I(D), 55V, 0.0037OHM,

0

BUK662R5-30C,118-NXP

BUK662R5-30C,118-NXP

NXP Semiconductors

PFET, 100A I(D), 30V, 0.0048OHM,

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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