Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
PH6030DLV115

PH6030DLV115

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

0

PH4030DLV115

PH4030DLV115

NXP Semiconductors

SMALL SIGNAL N-CHANNEL MOSFET

333000

PHB101NQ04T,118

PHB101NQ04T,118

NXP Semiconductors

MOSFET N-CH 40V 75A D2PAK

0

PSMN023-40YLCX

PSMN023-40YLCX

NXP Semiconductors

MOSFET N-CH 40V 24A LFPAK56

0

PHP32N06LT,127

PHP32N06LT,127

NXP Semiconductors

MOSFET N-CH 60V 34A TO220AB

0

PMN22XN,115

PMN22XN,115

NXP Semiconductors

MOSFET N-CH 30V 5.7A 6TSOP

0

PH6030L,115

PH6030L,115

NXP Semiconductors

MOSFET N-CH 30V 76.7A LFPAK56

0

BUK9635-55,118

BUK9635-55,118

NXP Semiconductors

MOSFET N-CH 55V 34A D2PAK

0

PSMN008-75P,127

PSMN008-75P,127

NXP Semiconductors

MOSFET N-CH 75V 75A TO220AB

0

BUK7524-55A,127

BUK7524-55A,127

NXP Semiconductors

MOSFET N-CH 55V 47A TO220AB

0

PHB108NQ03LT,118

PHB108NQ03LT,118

NXP Semiconductors

MOSFET N-CH 25V 75A D2PAK

0

BUK7624-55A,118

BUK7624-55A,118

NXP Semiconductors

MOSFET N-CH 55V 47A D2PAK

0

PHB96NQ03LT,118

PHB96NQ03LT,118

NXP Semiconductors

MOSFET N-CH 25V 75A D2PAK

0

BUK98150-55A,135

BUK98150-55A,135

NXP Semiconductors

MOSFET N-CH 55V 5.5A SOT-223

0

PSMN005-25D,118

PSMN005-25D,118

NXP Semiconductors

MOSFET N-CH 25V 75A DPAK

0

PHP174NQ04LT,127

PHP174NQ04LT,127

NXP Semiconductors

MOSFET N-CH 40V 75A TO220AB

0

BUK7609-55A,118

BUK7609-55A,118

NXP Semiconductors

MOSFET N-CH 55V 75A D2PAK

0

BUK9616-55A,118

BUK9616-55A,118

NXP Semiconductors

MOSFET N-CH 55V 66A D2PAK

0

PHP143NQ04T,127

PHP143NQ04T,127

NXP Semiconductors

MOSFET N-CH 40V 75A TO220AB

0

PH3075L,115

PH3075L,115

NXP Semiconductors

MOSFET N-CH 75V 30A LFPAK56

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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