Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
TSM05N03CW RPG

TSM05N03CW RPG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 30V 5A SOT223

1801

TSM170N06CP ROG

TSM170N06CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 60V 38A TO252

17047

TSM13ND50CI

TSM13ND50CI

TSC (Taiwan Semiconductor)

MOSFET N-CH 500V 13A ITO220

3934

TSM3N90CH C5G

TSM3N90CH C5G

TSC (Taiwan Semiconductor)

MOSFET N-CH 900V 2.5A TO251

1859

TSM4806CS RLG

TSM4806CS RLG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 20V 28A 8SOP

1618

TSM4NB65CP ROG

TSM4NB65CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 650V 4A TO252

2485

TSM60N750CH C5G

TSM60N750CH C5G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 600V 6A TO251

0

TSM60NB190CM2 RNG

TSM60NB190CM2 RNG

TSC (Taiwan Semiconductor)

MOSFET N-CH 600V 18A TO263

550

TSM150NB04CR RLG

TSM150NB04CR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 40V 10A/41A 8PDFN

4954

TSM4N80CZ C0G

TSM4N80CZ C0G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 800V 4A TO220

969

TSM250N02CX RFG

TSM250N02CX RFG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 20V 5.8A SOT23

5640

TSM80N950CP ROG

TSM80N950CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 800V 6A TO252

17940

TSM900N06CW RPG

TSM900N06CW RPG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 60V 11A SOT223

8641

TSM4N60ECP ROG

TSM4N60ECP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 600V 4A TO252

2402

TSM220NB06CR RLG

TSM220NB06CR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 60V 8A/35A 8PDFN

5000

TSM650N15CR RLG

TSM650N15CR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 150V 24A 8PDFN

3185

TSM048NB06LCR RLG

TSM048NB06LCR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 60V 16A/107A 8PDFN

4910

TSM080NB03CR RLG

TSM080NB03CR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 30V 14A/59A 8PDFN

2500

TSM60NB099CF C0G

TSM60NB099CF C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 600V 38A ITO220S

0

TSM210N02CX RFG

TSM210N02CX RFG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 20V 6.7A SOT23

2036

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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