Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
TSM60N600CI C0G

TSM60N600CI C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 600V 8A ITO220AB

0

TSM2302CX RFG

TSM2302CX RFG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 20V 3.9A SOT23

10788

TSM70NB1R4CP ROG

TSM70NB1R4CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 700V 3A TO252

2302

TSM260P02CX6 RFG

TSM260P02CX6 RFG

TSC (Taiwan Semiconductor)

MOSFET P-CHANNEL 20V 6.5A SOT26

9576

TSM033NB04CR RLG

TSM033NB04CR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 40V 21A/121A 8PDFN

4930

TSM170N06CH C5G

TSM170N06CH C5G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 60V 38A TO251

0

TSM2N7000KCT B0G

TSM2N7000KCT B0G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 60V 300MA TO92

0

TSM60NB099CZ C0G

TSM60NB099CZ C0G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 600V 38A TO220

642

TSM4ND60CI C0G

TSM4ND60CI C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 600V 4A ITO220

464

TSM060N03CP ROG

TSM060N03CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 30V 70A TO252

6451

TSM4800N15CX6 RFG

TSM4800N15CX6 RFG

TSC (Taiwan Semiconductor)

MOSFET N-CH 150V 1.4A SOT26

0

TSM3446CX6 RFG

TSM3446CX6 RFG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 20V 5.3A SOT26

7696

TSM2328CX RFG

TSM2328CX RFG

TSC (Taiwan Semiconductor)

MOSFET N-CH 100V 1.5A SOT23

24550

TSM9435CS RLG

TSM9435CS RLG

TSC (Taiwan Semiconductor)

MOSFET P-CHANNEL 30V 5.3A 8SOP

4935

TSM3N90CP ROG

TSM3N90CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CH 900V 2.5A TO252

2390

TSM60NB600CP ROG

TSM60NB600CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 600V 7A TO252

0

TSM900N10CH X0G

TSM900N10CH X0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 100V 15A TO251

3575

TSM230N06CP ROG

TSM230N06CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 60V 34A TO252

13055

TSM60NB041PW C1G

TSM60NB041PW C1G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 600V 78A TO247

2535

TSM1N80CW RPG

TSM1N80CW RPG

TSC (Taiwan Semiconductor)

MOSFET N-CH 800V 300MA SOT223

352

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

RFQ BOM Call Skype Email
Top