Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
TQM070NB04CR RLG

TQM070NB04CR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 40V 15A/75A 8PDFNU

4400

TQM025NB04CR RLG

TQM025NB04CR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 40V 24A/157A 8PDFNU

5000

TSM100N06CZ C0G

TSM100N06CZ C0G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 60V 100A TO220

320

TSM650P03CX RFG

TSM650P03CX RFG

TSC (Taiwan Semiconductor)

MOSFET P-CHANNEL 30V 4.1A SOT23

3229

TSM9N90ECZ C0G

TSM9N90ECZ C0G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 900V 9A TO220

969

TSM130NB06LCR

TSM130NB06LCR

TSC (Taiwan Semiconductor)

MOSFET N-CH 60V 10A/51A 8PDFN

0

TSM85N10CZ C0G

TSM85N10CZ C0G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 100V 81A TO220

882

TSM8N80CI C0G

TSM8N80CI C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 800V 8A ITO220AB

0

TSM280NB06LCR RLG

TSM280NB06LCR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 60V 7A/28A 8PDFN

5000

TSM600P03CS RLG

TSM600P03CS RLG

TSC (Taiwan Semiconductor)

MOSFET P-CHANNEL 30V 4.7A 8SOP

4937

TSM020N04LCR RLG

TSM020N04LCR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 40V 170A 8PDFN

0

TSM480P06CH X0G

TSM480P06CH X0G

TSC (Taiwan Semiconductor)

MOSFET P-CHANNEL 60V 20A TO251

11732

TSM3N90CI C0G

TSM3N90CI C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 900V 2.5A ITO220AB

978

TSM2303CX RFG

TSM2303CX RFG

TSC (Taiwan Semiconductor)

MOSFET P-CHANNEL 30V 1.3A SOT23

2489

TSM240N03CX6 RFG

TSM240N03CX6 RFG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 30V 6.5A SOT26

9000

TSM60NB190CZ C0G

TSM60NB190CZ C0G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 600V 18A TO220

3953

TSM4N60ECH C5G

TSM4N60ECH C5G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 600V 4A TO251

0

TSM9409CS RLG

TSM9409CS RLG

TSC (Taiwan Semiconductor)

MOSFET P-CHANNEL 60V 3.5A 8SOP

2062

TSM60N750CP ROG

TSM60N750CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 600V 6A TO252

0

TSM3401CX RFG

TSM3401CX RFG

TSC (Taiwan Semiconductor)

MOSFET P-CHANNEL 30V 3A SOT23

17854

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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