Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
TSM126CX RFG

TSM126CX RFG

TSC (Taiwan Semiconductor)

MOSFET N-CH 600V 30MA SOT23

538

TSM110NB04LCR RLG

TSM110NB04LCR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 40V 12A/54A 8PDFN

2500

TSM1NB60CH C5G

TSM1NB60CH C5G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 600V 1A TO251

1797

TSM80N950CH C5G

TSM80N950CH C5G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 800V 6A TO251

3236

TSM80N1R2CH C5G

TSM80N1R2CH C5G

TSC (Taiwan Semiconductor)

MOSFET N-CH 800V 5.5A TO251

3710

TSM120N06LCS RLG

TSM120N06LCS RLG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 60V 23A 8SOP

4498

TSM5NC50CZ C0G

TSM5NC50CZ C0G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 500V 5A TO220

0

TSM045NA03CR RLG

TSM045NA03CR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 30V 108A 8PDFN

4972

TSM60NB600CF C0G

TSM60NB600CF C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 600V 8A ITO220S

3652

TSM4NC50CP ROG

TSM4NC50CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 500V 4A TO252

12

TSM018NB03CR RLG

TSM018NB03CR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 30V 29A/194A 8PDFN

2500

TQM050NB06CR RLG

TQM050NB06CR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 60V 16A/104A PDFN56U

2500

TSM1NB60CP ROG

TSM1NB60CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 600V 1A TO252

2204

TSM7N90CZ C0G

TSM7N90CZ C0G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 900V 7A TO220

974

TSM60N1R4CP ROG

TSM60N1R4CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CH 600V 3.3A TO252

0

TSM045NB06CR RLG

TSM045NB06CR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 60V 16A/104A 8PDFN

4930

TSM070NB04CR RLG

TSM070NB04CR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 40V 15A/75A 8PDFN

0

TSM9ND50CI

TSM9ND50CI

TSC (Taiwan Semiconductor)

MOSFET N-CH 500V 9A ITO220

3986

TSM085P03CS RLG

TSM085P03CS RLG

TSC (Taiwan Semiconductor)

MOSFET P-CHANNEL 30V 34A 8SOP

3202

TSM70N380CP ROG

TSM70N380CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 700V 11A TO252

8465

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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