Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
TSM7N65ACI C0G

TSM7N65ACI C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 650V 7A ITO220AB

0

TSM1N45CT A3G

TSM1N45CT A3G

TSC (Taiwan Semiconductor)

MOSFET N-CH 450V 500MA TO92

0

TSM8N50CP ROG

TSM8N50CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CH 500V 7.2A TO252

0

TSM8N70CI C0G

TSM8N70CI C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 700V 8A ITO220AB

0

TSM2311CX RFG

TSM2311CX RFG

TSC (Taiwan Semiconductor)

MOSFET P-CHANNEL 20V 4A SOT23

0

TSM1N45DCS RLG

TSM1N45DCS RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 450V 500MA 8SOP

0

TSM13N50ACI C0G

TSM13N50ACI C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 500V 13A ITO220AB

0

TSM210N06CZ C0G

TSM210N06CZ C0G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 60V 210A TO220

0

TSM1NB60SCT B0G

TSM1NB60SCT B0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 600V 500MA TO92

0

TSM4NB60CZ C0G

TSM4NB60CZ C0G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 600V 4A TO220

0

TSM1N45CW RPG

TSM1N45CW RPG

TSC (Taiwan Semiconductor)

MOSFET N-CH 450V 500MA SOT223

0

TSM4N70CP ROG

TSM4N70CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CH 700V 3.5A TO252

0

TSM6NB60CZ C0G

TSM6NB60CZ C0G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 600V 6A TO220

0

TSM2NB65CH X0G

TSM2NB65CH X0G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 650V 2A TO251

0

TSM4NC60CI C0G

TSM4NC60CI C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 600V 4A ITO220AB

0

TSM6N60CH C5G

TSM6N60CH C5G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 600V 6A TO251

0

TSM10N60CZ C0

TSM10N60CZ C0

TSC (Taiwan Semiconductor)

MOSFET N-CH 600V 10A TO220

0

TSM10N06CP ROG

TSM10N06CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 60V 10A TO252

0

TSM2NB60CP ROG

TSM2NB60CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 600V 2A TO252

0

TSM052N06PQ56 RLG

TSM052N06PQ56 RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 60V 100A 8PDFN

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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