Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
TSM4436CS RLG

TSM4436CS RLG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 60V 8A 8SOP

2837

TSM036N03PQ56 RLG

TSM036N03PQ56 RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 30V 124A 8PDFN

4891

TSM160N10LCR RLG

TSM160N10LCR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 100V 46A 8PDFN

5298

TSM3481CX6 RFG

TSM3481CX6 RFG

TSC (Taiwan Semiconductor)

MOSFET P-CHANNEL 30V 5.7A SOT26

1454

TSM033NA04LCR RLG

TSM033NA04LCR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 40V 141A 8PDFN

4885

TSM60N1R4CH C5G

TSM60N1R4CH C5G

TSC (Taiwan Semiconductor)

MOSFET N-CH 600V 3.3A TO251

0

TSM042N03CS RLG

TSM042N03CS RLG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 30V 30A 8SOP

2397

TSM240N03CX RFG

TSM240N03CX RFG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 30V 6.5A SOT23

263

TSM3N100CP ROG

TSM3N100CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CH 1000V 2.5A TO252

0

TSM2301ACX RFG

TSM2301ACX RFG

TSC (Taiwan Semiconductor)

MOSFET P-CHANNEL 20V 2.8A SOT23

35863

TSM60NB600CH C5G

TSM60NB600CH C5G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 600V 7A TO251

0

TSM60NB900CP ROG

TSM60NB900CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 600V 4A TO252

13308

TSM80N1R2CL C0G

TSM80N1R2CL C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 800V 5.5A TO262S

0

TSM2N7002KCU

TSM2N7002KCU

TSC (Taiwan Semiconductor)

60V, 0.24A, SINGLE N-CHANNEL POW

0

BSS84W

BSS84W

TSC (Taiwan Semiconductor)

-60, -0.14, SINGLE P-CHANNEL

0

TSM035NB04CZ

TSM035NB04CZ

TSC (Taiwan Semiconductor)

MOSFET N-CH 40V 18A/157A TO220

4000

TSM043NB04CZ

TSM043NB04CZ

TSC (Taiwan Semiconductor)

MOSFET N-CH 40V 16A/124A TO220

3996

TSM70N600ACL X0G

TSM70N600ACL X0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 700V 8A TO262S

950

TSM6N50CP ROG

TSM6N50CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CH 500V 5.6A TO252

0

TSM10NB60CI C0G

TSM10NB60CI C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 600V 10A ITO220AB

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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