Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
TSM4N70CH C5G

TSM4N70CH C5G

TSC (Taiwan Semiconductor)

MOSFET N-CH 700V 3.5A TO251

0

TSM4N70CI C0G

TSM4N70CI C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 700V 3.5A ITO220AB

0

TSM6NB60CI C0G

TSM6NB60CI C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 600V 6A ITO220AB

0

TQM150NB04CR RLG

TQM150NB04CR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 40V 10A/41A PDFN56U

2500

TSM22P10CZ C0G

TSM22P10CZ C0G

TSC (Taiwan Semiconductor)

MOSFET P-CH 100V 22A TO220

0

TSM4459CS RLG

TSM4459CS RLG

TSC (Taiwan Semiconductor)

MOSFET P-CHANNEL 30V 17A 8SOP

0

TSM120N10PQ56 RLG

TSM120N10PQ56 RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 100V 58A 8PDFN

0

TSM680P06CZ C0G

TSM680P06CZ C0G

TSC (Taiwan Semiconductor)

MOSFET P-CH 60V 18A TO220

0

TSM10N60CZ C0G

TSM10N60CZ C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 600V 10A TO220

0

TSM1N45CT B0G

TSM1N45CT B0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 450V 500MA TO92

0

TSM6N60CP ROG

TSM6N60CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 600V 6A TO252

0

TSM8N50CH C5G

TSM8N50CH C5G

TSC (Taiwan Semiconductor)

MOSFET N-CH 500V 7.2A TO251

0

TSM2N7000KCT A3G

TSM2N7000KCT A3G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 60V 300MA TO92

0

TSM230N06CZ C0G

TSM230N06CZ C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 60V 50A TO220

0

TSM6N50CH C5G

TSM6N50CH C5G

TSC (Taiwan Semiconductor)

MOSFET N-CH 500V 5.6A TO251

0

TSM480P06CZ C0G

TSM480P06CZ C0G

TSC (Taiwan Semiconductor)

MOSFET P-CH 60V 20A TO220

0

TSM1NB60SCT A3G

TSM1NB60SCT A3G

TSC (Taiwan Semiconductor)

MOSFET N-CH 600V 500MA TO92

0

TSM4435BCS RLG

TSM4435BCS RLG

TSC (Taiwan Semiconductor)

MOSFET P-CHANNEL 30V 9.1A 8SOP

0

TSM2301CX RFG

TSM2301CX RFG

TSC (Taiwan Semiconductor)

MOSFET P-CHANNEL 20V 2.8A SOT23

0

TSM3404CX RFG

TSM3404CX RFG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 30V 5.8A SOT23

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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