Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
TSM130NB06CR RLG

TSM130NB06CR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 60V 10A/51A 8PDFN

0

TSM070NB04LCR RLG

TSM070NB04LCR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 40V 15A/75A 8PDFN

2785

TSM850N06CX RFG

TSM850N06CX RFG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 60V 3A SOT23

9521

TSM026NA03CR RLG

TSM026NA03CR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 30V 168A 8PDFN

4850

TSM60N380CZ C0G

TSM60N380CZ C0G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 600V 11A TO220

3995

TSM2N60ECH C5G

TSM2N60ECH C5G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 600V 2A TO251

0

TSM60NB190CF C0G

TSM60NB190CF C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 600V 18A ITO220S

3932

TSM60N380CI C0G

TSM60N380CI C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 600V 11A ITO220AB

975

TSM7NC60CF C0G

TSM7NC60CF C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 600V 7A ITO220S

955

TSM4424CS RVG

TSM4424CS RVG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 20V 8A 8SOP

2429

TSM038N03PQ33 RGG

TSM038N03PQ33 RGG

TSC (Taiwan Semiconductor)

MOSFET N-CH 30V 78A 8PDFN

4499

TSM2N7002KCX RFG

TSM2N7002KCX RFG

TSC (Taiwan Semiconductor)

MOSFET N-CH 60V 300MA SOT23

50780

TSM4NB60CI C0G

TSM4NB60CI C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 600V 4A ITO220AB

844

TSM061NA03CR RLG

TSM061NA03CR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 30V 88A 8PDFN

0

TSM10NC60CF C0G

TSM10NC60CF C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 600V 10A ITO220S

0

TSM60NB190CI C0G

TSM60NB190CI C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 600V 18A ITO220AB

3934

TSM5NC50CP ROG

TSM5NC50CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 500V 5A TO252

2433

TSM2305CX RFG

TSM2305CX RFG

TSC (Taiwan Semiconductor)

MOSFET P-CHANNEL 20V 3.2A SOT23

4591

TSM055N03EPQ56 RLG

TSM055N03EPQ56 RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 30V 80A 8PDFN

3670

TSM60NB380CH C5G

TSM60NB380CH C5G

TSC (Taiwan Semiconductor)

MOSFET N-CH 600V 9.5A TO251

3726

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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