Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
TSM60N380CH C5G

TSM60N380CH C5G

TSC (Taiwan Semiconductor)

MOSFET N-CH 600V 11A TO251

0

TSM180N03CS RLG

TSM180N03CS RLG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 30V 9A 8SOP

4982

TSM025NB04LCR RLG

TSM025NB04LCR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 40V 24A/161A 8PDFN

4826

TSM301K12CQ RFG

TSM301K12CQ RFG

TSC (Taiwan Semiconductor)

MOSFET P-CH 20V 4.5A 6TDFN

11169

TSM2309CX RFG

TSM2309CX RFG

TSC (Taiwan Semiconductor)

MOSFET P-CHANNEL 60V 3.1A SOT23

0

TSM4NB65CI C0G

TSM4NB65CI C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 650V 4A ITO220AB

942

TSM950N10CW RPG

TSM950N10CW RPG

TSC (Taiwan Semiconductor)

MOSFET N-CH 100V 6.5A SOT223

1935

TSM15N50CZ C0G

TSM15N50CZ C0G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 500V 14A TO220

946

TSM170N06PQ56 RLG

TSM170N06PQ56 RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 60V 44A 8PDFN

2

TSM040N03CP ROG

TSM040N03CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 30V 90A TO252

16

TSM4NB60CP ROG

TSM4NB60CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 600V 4A TO252

856

TSM160P04LCRHRLG

TSM160P04LCRHRLG

TSC (Taiwan Semiconductor)

MOSFET P-CH 40V 51A 8PDFN

2262

TSM055N03PQ56 RLG

TSM055N03PQ56 RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 30V 80A 8PDFN

2484

TSM070NA04LCR RLG

TSM070NA04LCR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 40V 91A 8PDFN

4925

TSM033NB04LCR RLG

TSM033NB04LCR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 40V 21A/121A 8PDFN

4800

TSM60NB1R4CP ROG

TSM60NB1R4CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 600V 3A TO252

2264

TSM2N100CH C5G

TSM2N100CH C5G

TSC (Taiwan Semiconductor)

MOSFET N-CH 1000V 1.85A TO251

1790

TSM60N380CP ROG

TSM60N380CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 600V 11A TO252

0

TSM35N10CP ROG

TSM35N10CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 100V 32A TO252

6767

TSM7ND60CI

TSM7ND60CI

TSC (Taiwan Semiconductor)

MOSFET N-CH 600V 7A ITO220

3951

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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