Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
TSM70N750CP ROG

TSM70N750CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 700V 6A TO252

4720

TSM4NB60CH C5G

TSM4NB60CH C5G

TSC (Taiwan Semiconductor)

MOSFET N-CH 600V 4A TO251

15180

TSM70N900CP ROG

TSM70N900CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CH 700V 4.5A TO252

2458

TSM70N600CH C5G

TSM70N600CH C5G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 700V 8A TO251

805

TSM300NB06CR RLG

TSM300NB06CR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 60V 6A/27A 8PDFN

2495

TSM60N900CI C0G

TSM60N900CI C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 600V 4.5A ITO220AB

870

TSM650P02CX RFG

TSM650P02CX RFG

TSC (Taiwan Semiconductor)

MOSFET P-CHANNEL 20V 4.1A SOT23

1539

TSM60NB260CI C0G

TSM60NB260CI C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 600V 13A ITO220AB

933

TSM10N80CI C0G

TSM10N80CI C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 800V 9.5A ITO220AB

661

TSM3N90CZ C0G

TSM3N90CZ C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 900V 2.5A TO220

986

TSM190N08CZ C0G

TSM190N08CZ C0G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 75V 190A TO220

700

TSM600N25ECH C5G

TSM600N25ECH C5G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 250V 8A TO251

1791

TSM3N80CI C0G

TSM3N80CI C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 800V 3A ITO220AB

0

TSM60NB380CP ROG

TSM60NB380CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CH 600V 9.5A TO252

2128

TSM1NB60CW RPG

TSM1NB60CW RPG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 600V 1A SOT223

10992

TSM150NB04LCR RLG

TSM150NB04LCR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 40V 10A/41A 8PDFN

4746

TSM033NA03CR RLG

TSM033NA03CR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 30V 129A 8PDFN

2340

TSM024NA04LCR RLG

TSM024NA04LCR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 40V 170A 8PDFN

4893

TSM680P06CP ROG

TSM680P06CP ROG

TSC (Taiwan Semiconductor)

MOSFET P-CHANNEL 60V 18A TO252

68

TSM70N600CP ROG

TSM70N600CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 700V 8A TO252

1494

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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