Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
TSM080N03PQ56 RLG

TSM080N03PQ56 RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 30V 73A 8PDFN

4915

TSM2314CX RFG

TSM2314CX RFG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 20V 4.9A SOT23

13119

TSM320N03CX RFG

TSM320N03CX RFG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 30V 5.5A SOT23

5927

TSM7NC65CF C0G

TSM7NC65CF C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 650V 7A ITO220S

1984

TSM160P02CS RLG

TSM160P02CS RLG

TSC (Taiwan Semiconductor)

MOSFET P-CHANNEL 20V 11A 8SOP

5497

TSM340N06CP ROG

TSM340N06CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 60V 30A TO252

1816

TSM230N06PQ56 RLG

TSM230N06PQ56 RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 60V 44A 8PDFN

6170

TSM10N80CZ C0G

TSM10N80CZ C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 800V 9.5A TO220

735

TSM680P06CH X0G

TSM680P06CH X0G

TSC (Taiwan Semiconductor)

MOSFET P-CHANNEL 60V 18A TO251

15445

TQM130NB06CR RLG

TQM130NB06CR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 60V 10A/50A 8PDFNU

5000

TQM110NB04CR RLG

TQM110NB04CR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 40V 12A/54A 8PDFNU

5000

TSM70N1R4CH C5G

TSM70N1R4CH C5G

TSC (Taiwan Semiconductor)

MOSFET N-CH 700V 3.3A TO251

0

TSM089N08LCR RLG

TSM089N08LCR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 80V 67A 8PDFN

343

TSM60NB380CF C0G

TSM60NB380CF C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 600V 11A ITO220S

0

TSM130NB06LCR RLG

TSM130NB06LCR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 60V 10A/51A 8PDFN

4744

TSM70N600CI C0G

TSM70N600CI C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 700V 8A ITO220AB

0

TSM70N380CH C5G

TSM70N380CH C5G

TSC (Taiwan Semiconductor)

MOSFET N-CH 700V 11A TO251

3749

TSM015NA03CR RLG

TSM015NA03CR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 30V 205A 8PDFN

4973

TSM340N06CH X0G

TSM340N06CH X0G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 60V 30A TO251

12392

TSM180N03PQ33 RGG

TSM180N03PQ33 RGG

TSC (Taiwan Semiconductor)

MOSFET N-CH 30V 25A 8PDFN

538

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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