Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
TSM900N10CP ROG

TSM900N10CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 100V 15A TO252

7395

TSM4NB60CH X0G

TSM4NB60CH X0G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 600V 4A TO251

0

TSM2312CX RFG

TSM2312CX RFG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 20V 4.9A SOT23

31165

TSM2307CX RFG

TSM2307CX RFG

TSC (Taiwan Semiconductor)

MOSFET P-CHANNEL 30V 3A SOT23

31451

TSM180P03CS RLG

TSM180P03CS RLG

TSC (Taiwan Semiconductor)

MOSFET P-CHANNEL 30V 10A 8SOP

4670

TSM2306CX RFG

TSM2306CX RFG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 30V 3.5A SOT23

46975

TSM061NA03CV RGG

TSM061NA03CV RGG

TSC (Taiwan Semiconductor)

MOSFET N-CH 30V 66A 8PDFN

0

TSM4N90CZ C0G

TSM4N90CZ C0G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 900V 4A TO220

4000

TSM3N80CH C5G

TSM3N80CH C5G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 800V 3A TO251

3711

TSM70N750CH C5G

TSM70N750CH C5G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 700V 6A TO251

1802

TSM15N50CI C0G

TSM15N50CI C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 500V 14A ITO220AB

973

TSM150P03PQ33 RGG

TSM150P03PQ33 RGG

TSC (Taiwan Semiconductor)

MOSFET P-CH 30V 36A 8PDFN

4111

TSM4N80CI C0G

TSM4N80CI C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 800V 4A ITO220AB

0

TSM650N15CS RLG

TSM650N15CS RLG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 150V 9A 8SOP

5035

TSM60N06CP ROG

TSM60N06CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 60V 66A TO252

4094

TSM60NB900CH C5G

TSM60NB900CH C5G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 600V 4A TO251

14083

TSM025NB04CR RLG

TSM025NB04CR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 40V 24A/161A 8PDFN

4960

TSM038N04LCP ROG

TSM038N04LCP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 40V 135A TO252

2317

TSM80N08CZ C0G

TSM80N08CZ C0G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 75V 80A TO220

827

TQM250NB06CR RLG

TQM250NB06CR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 60V 7A/32A 8PDFNU

5000

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

RFQ BOM Call Skype Email
Top