Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
TSM70N10CP ROG

TSM70N10CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 100V 70A TO252

33

TSM9N90ECI C0G

TSM9N90ECI C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 900V 9A ITO220AB

857

TSM018NA03CR RLG

TSM018NA03CR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 30V 185A 8PDFN

4815

TSM3457CX6 RFG

TSM3457CX6 RFG

TSC (Taiwan Semiconductor)

MOSFET P-CHANNEL 30V 5A SOT26

5424

TSM2N100CP ROG

TSM2N100CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CH 1000V 1.85A TO252

1266

TSM70N1R4CP ROG

TSM70N1R4CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CH 700V 3.3A TO252

0

TSM160N10CZ C0G

TSM160N10CZ C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 100V 160A TO220

0

TSM80N1R2CI C0G

TSM80N1R2CI C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 800V 5.5A ITO220AB

975

TSM60N600CH C5G

TSM60N600CH C5G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 600V 8A TO251

0

TSM3N80CZ C0G

TSM3N80CZ C0G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 800V 3A TO220

988

TSM10NC65CF C0G

TSM10NC65CF C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 650V 10A ITO220S

814

TSM60N900CP ROG

TSM60N900CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CH 600V 4.5A TO252

0

TSM60NB099PW C1G

TSM60NB099PW C1G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 600V 38A TO247

99

TSM060N03ECP ROG

TSM060N03ECP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 30V 70A TO252

4929

TSM500P02CX RFG

TSM500P02CX RFG

TSC (Taiwan Semiconductor)

MOSFET P-CHANNEL 20V 4.7A SOT23

10866

TSM60NB1R4CH C5G

TSM60NB1R4CH C5G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 600V 3A TO251

21651

TSM085P03CV RGG

TSM085P03CV RGG

TSC (Taiwan Semiconductor)

MOSFET P-CH 30V 64A 8PDFN

6733

TSM3443CX6 RFG

TSM3443CX6 RFG

TSC (Taiwan Semiconductor)

MOSFET P-CHANNEL 20V 4.7A SOT26

7431

TSM090N03ECP ROG

TSM090N03ECP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 30V 50A TO252

11526

TSM4N90CI C0G

TSM4N90CI C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 900V 4A ITO220AB

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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