Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
TSM60NB150CF C0G

TSM60NB150CF C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 600V 24A ITO220S

36

TSM480P06CP ROG

TSM480P06CP ROG

TSC (Taiwan Semiconductor)

MOSFET P-CHANNEL 60V 20A TO252

4284

TSM2N60ECP ROG

TSM2N60ECP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 600V 2A TO252

2487

TSM3N80CP ROG

TSM3N80CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 800V 3A TO252

2415

TSM900N06CP ROG

TSM900N06CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 60V 11A TO252

0

TSM80N950CI C0G

TSM80N950CI C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 800V 6A ITO220AB

478

TSM120N06LCP ROG

TSM120N06LCP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 60V 70A TO252

0

TSM2301BCX RFG

TSM2301BCX RFG

TSC (Taiwan Semiconductor)

MOSFET P-CHANNEL 20V 2.8A SOT23

6

TSM7P06CP ROG

TSM7P06CP ROG

TSC (Taiwan Semiconductor)

MOSFET P-CHANNEL 60V 7A TO252

1103

TSM4ND65CI

TSM4ND65CI

TSC (Taiwan Semiconductor)

MOSFET N-CH 650V 4A ITO220

3944

TSM5NC50CF C0G

TSM5NC50CF C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 500V 5A ITO220S

977

TSM085N03PQ33 RGG

TSM085N03PQ33 RGG

TSC (Taiwan Semiconductor)

MOSFET N-CH 30V 52A 8PDFN

19596

TSM70N900CI C0G

TSM70N900CI C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 700V 4.5A ITO220AB

920

TSM2323CX RFG

TSM2323CX RFG

TSC (Taiwan Semiconductor)

MOSFET P-CHANNEL 20V 4.7A SOT23

0

TSM900N06CH X0G

TSM900N06CH X0G

TSC (Taiwan Semiconductor)

MOSFET N-CHANNEL 60V 11A TO251

3850

TSM060N03PQ33 RGG

TSM060N03PQ33 RGG

TSC (Taiwan Semiconductor)

MOSFET N-CH 30V 62A 8PDFN

3913

TSM80N1R2CP ROG

TSM80N1R2CP ROG

TSC (Taiwan Semiconductor)

MOSFET N-CH 800V 5.5A TO252

6290

TQM033NB04CR RLG

TQM033NB04CR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 40V 21A/121A PDFN56U

2500

TSM088NA03CR RLG

TSM088NA03CR RLG

TSC (Taiwan Semiconductor)

MOSFET N-CH 30V 61A 8PDFN

0

TSM80N400CF C0G

TSM80N400CF C0G

TSC (Taiwan Semiconductor)

MOSFET N-CH 800V 12A ITO220S

1913

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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