Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
NVMYS8D0N04CTWG

NVMYS8D0N04CTWG

Sanyo Semiconductor/ON Semiconductor

MOSFET N-CH 40V 16A/49A 4LFPAK

0

IXTP3N120

IXTP3N120

Wickmann / Littelfuse

MOSFET N-CH 1200V 3A TO220AB

0

IPP65R065C7XKSA1

IPP65R065C7XKSA1

IR (Infineon Technologies)

MOSFET N-CH 650V 33A TO220-3

0

SQJ460AEP-T1_GE3

SQJ460AEP-T1_GE3

Vishay / Siliconix

MOSFET N-CH 60V 32A PPAK SO-8

919

ZVNL120A

ZVNL120A

Zetex Semiconductors (Diodes Inc.)

MOSFET N-CH 200V 180MA TO92-3

615512000

SPI20N60CFD

SPI20N60CFD

IR (Infineon Technologies)

N-CHANNEL POWER MOSFET

400

STP150N3LLH6

STP150N3LLH6

STMicroelectronics

MOSFET N-CH 30V 80A TO220AB

0

DN1509N8-G

DN1509N8-G

Roving Networks / Microchip Technology

MOSFET N-CH 90V 360MA TO243AA

553

STD3NK80ZT4

STD3NK80ZT4

STMicroelectronics

MOSFET N-CH 800V 2.5A DPAK

1249

3LP03M-TL-E

3LP03M-TL-E

Sanyo Denki SanUPS Products

P-CHANNEL SILICON MOSFET

6000

TPH3208LDG

TPH3208LDG

Transphorm

GANFET N-CH 650V 20A 3PQFN

285

IRFP150PBF

IRFP150PBF

Vishay / Siliconix

MOSFET N-CH 100V 41A TO247-3

1148

IXFB62N80Q3

IXFB62N80Q3

Wickmann / Littelfuse

MOSFET N-CH 800V 62A PLUS264

25

SSM3J118TU(TE85L)

SSM3J118TU(TE85L)

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 30V 1.4A UFM

1865

NTD20N06-1G

NTD20N06-1G

MOSFET N-CH 60V 20A IPAK

1425

FDMS86200

FDMS86200

Sanyo Semiconductor/ON Semiconductor

MOSFET N-CH 150V 9.6A/35A 8PQFN

2147483647

FQP14N30

FQP14N30

Sanyo Semiconductor/ON Semiconductor

MOSFET N-CH 300V 14.4A TO220-3

2194

PSMN015-100YLX

PSMN015-100YLX

Nexperia

MOSFET N-CH 100V 69A LFPAK56

0

IPP80P03P4L04AKSA2

IPP80P03P4L04AKSA2

IR (Infineon Technologies)

MOSFET P-CH 30V 80A TO220-3

0

NTMFS4C08NT3G

NTMFS4C08NT3G

Sanyo Semiconductor/ON Semiconductor

MOSFET N-CH 30V 9A/52A 5DFN

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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