Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
BSD316SNL6327XT

BSD316SNL6327XT

IR (Infineon Technologies)

MOSFET N-CH 30V 1.4A SOT363-6

1017

DMN2100UDM-7

DMN2100UDM-7

Zetex Semiconductors (Diodes Inc.)

MOSFET N-CH 20V 3.3A SOT-26

3812

NVMFS5C628NLAFT1G

NVMFS5C628NLAFT1G

Sanyo Semiconductor/ON Semiconductor

MOSFET N-CH 60V 28A/150A 5DFN

0

IPL60R285P7AUMA1

IPL60R285P7AUMA1

IR (Infineon Technologies)

MOSFET N-CH 600V 13A 4VSON

5808

IRLS4030TRL7PP

IRLS4030TRL7PP

IR (Infineon Technologies)

MOSFET N-CH 100V 190A D2PAK

3120

IRFU420APBF

IRFU420APBF

Vishay / Siliconix

MOSFET N-CH 500V 3.3A TO251AA

447

STD7ANM60N

STD7ANM60N

STMicroelectronics

MOSFET N-CH 600V 5A DPAK

300

SQ2308CES-T1_GE3

SQ2308CES-T1_GE3

Vishay / Siliconix

MOSFET N-CH 60V 2.3A SOT23

11498

IPB180N06S4H1ATMA1

IPB180N06S4H1ATMA1

IR (Infineon Technologies)

MOSFET N-CH 60V 180A TO263-7

0

STD4NK80ZT4

STD4NK80ZT4

STMicroelectronics

MOSFET N-CH 800V 3A DPAK

0

2SK3140-E

2SK3140-E

Renesas Electronics America

N-CHANNEL POWER MOSFET

847

SI4427BDY-T1-GE3

SI4427BDY-T1-GE3

Vishay / Siliconix

MOSFET P-CH 30V 9.7A 8SO

0

BUK9Y6R5-40HX

BUK9Y6R5-40HX

Nexperia

MOSFET N-CH 40V 70A LFPAK56

1000

AONS21357

AONS21357

Alpha and Omega Semiconductor, Inc.

MOSFET P-CH 30V 21A/36A 8DFN

0

IRF1404STRLPBF

IRF1404STRLPBF

IR (Infineon Technologies)

MOSFET N-CH 40V 162A D2PAK

0

TK7E80W,S1X

TK7E80W,S1X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 800V 6.5A TO220

0

IRFR9110TRLPBF

IRFR9110TRLPBF

Vishay / Siliconix

MOSFET P-CH 100V 3.1A DPAK

2990

SCT3060AW7TL

SCT3060AW7TL

ROHM Semiconductor

TRANS SJT N-CH 650V 38A TO263-7

990

RQ6E060ATTCR

RQ6E060ATTCR

ROHM Semiconductor

MOSFET P-CH 30V 6A TSMT6

2746

TP5335K1-G

TP5335K1-G

Roving Networks / Microchip Technology

MOSFET P-CH 350V 85MA TO236AB

40854

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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