Transistors - FETs, MOSFETs

Transistors - FETs, MOSFETs - Single

Part Number	Description / PDF	Quantity
IMBG120R140M1HXTMA1 IR (Infineon Technologies)	TRANS SJT N-CH 1.2KV 18A TO263	932
STFU13N80K5 STMicroelectronics	MOSFET N-CH 800V 12A TO220FP	4991
STP9N80K5 STMicroelectronics	MOSFET N-CHANNEL 800V 7A TO220	0
SIS176LDN-T1-GE3 Vishay / Siliconix	N-CHANNEL 70 V (D-S) MOSFET POWE	50
2N6787	POWER FIELD-EFFECT TRANSISTOR, N	943
BUK9880-55A/CUX Nexperia	MOSFET N-CH 55V 7A SOT223	0
BUK7675-100A,118 Nexperia	PFET, 23A I(D), 100V, 0.075OHM,	0
SI4483ADY-T1-GE3 Vishay / Siliconix	MOSFET P-CH 30V 19.2A 8SO	12367
SIHU6N62E-GE3 Vishay / Siliconix	MOSFET N-CH 620V 6A IPAK	2874
G3R40MT12J GeneSiC Semiconductor	SIC MOSFET N-CH 75A TO263-7	212
IRFP26N60LPBF Vishay / Siliconix	MOSFET N-CH 600V 26A TO247-3	87
STD2LN60K3 STMicroelectronics	MOSFET N CH 600V 2A DPAK	0
STP22N60DM6 STMicroelectronics	MOSFET N-CH 600V 15A TO220	0
PHB20NQ20T118 Nexperia	N-CHANNEL POWER MOSFET	1600
STFU15N80K5 STMicroelectronics	MOSFET N-CH 800V 14A TO220FP	0
BSS316NH6327XTSA1 IR (Infineon Technologies)	MOSFET N-CH 30V 1.4A SOT23-3	39219
BSS606NH6327 IR (Infineon Technologies)	BSS606 - 250V-600V SMALL SIGNAL	415140
DN2540N3-G-P003 Roving Networks / Microchip Technology	MOSFET N-CH 400V 120MA TO92	1642
BUK9606-55A,118 Nexperia	MOSFET N-CH 55V 75A D2PAK	1594
APT30M40JVFR Roving Networks / Microchip Technology	MOSFET N-CH 300V 70A ISOTOP	0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Junction FET (JFET)	Voltage-controlled depletion mode operation, low noise	Low-noise amplifiers, analog switches
Enhancement Mode MOSFET	Normally-off device, requires positive V_GS to conduct	Power supplies, motor drives
Depletion Mode MOSFET	Normally-on device, requires negative V_GS to block	Radio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)	Combines MOSFET input with bipolar output, high current capacity	High-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO₂), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

Parameter	Description and Importance
V_DS (Drain-Source Voltage)	Maximum voltage rating between drain and source; determines breakdown tolerance
I_D (Drain Current)	Maximum continuous current capacity; critical for power handling
R_DS(on)	On-state resistance; impacts conduction losses and efficiency
V_GS(th) (Threshold Voltage)	Voltage required to form channel; determines control signal compatibility
Q_G (Gate Charge)	Charge required for switching; affects switching speed and driver requirements
P_D (Power Dissipation)	Maximum power handling capability; dictates thermal management needs

5. Application Fields

Consumer Electronics: Mobile phone chargers, notebook power adapters
Industrial: Motor drives, uninterruptible power supplies (UPS)
Automotive: Electric vehicle (EV) battery management systems, HEV inverters
Telecommunications: Base station power amplifiers, optical network transceivers
Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Texas Instruments	CSD18534Q5A	60V, 4.2m R_DS(on), automotive-grade
STMicroelectronics	STP55NF06	55A, 60V, high-speed switching
Infineon Technologies	IPB041N06N3	0.41 , 600V, TO-220 package
ON Semiconductor	NDS355AN	Depletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

Voltage and current requirements under operating conditions
Thermal performance (R_DS(on), package thermal resistance)
Switching speed vs. conduction loss trade-off
Gate drive compatibility with control circuitry
Environmental factors (temperature, vibration, humidity)
Cost-performance balance for volume production

8. Industry Trends

Current trends include:

Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
Advanced packaging technologies (double-sided cooling, copper clip)
Integration with gate drivers and protection circuits
Miniaturization through trench and shielded gate structures
Development of automotive-qualified devices for EVs and ADAS