Transistors - Bipolar (BJT) - RF

Image Part Number Description / PDF Quantity Rfq
EC4H09C-TL-H

EC4H09C-TL-H

TRANSISTOR

37000

BFR93AR,215

BFR93AR,215

NXP Semiconductors

RF SMALL SIGNAL TRANSISTOR

0

BFU550XRVL

BFU550XRVL

NXP Semiconductors

RF TRANS NPN 12V 11GHZ SOT143R

0

SS9018HBU

SS9018HBU

RF 0.05A, VERY HIGH FREQUENCY BA

15000

MRF1004MB

MRF1004MB

Metelics (MACOM Technology Solutions)

TRANS NPN 4W 960MHZ-1215MHZ

0

DSC5G0200L

DSC5G0200L

Panasonic

RF TRANS NPN 20V 650MHZ SMINI3

3643

KSC1674OTA

KSC1674OTA

RF SMALL SIGNAL TRANSISTOR

84000

MMBTH24

MMBTH24

RF 0.05A, VERY HIGH FREQUENCY BA

19751

BFR193WE6327

BFR193WE6327

IR (Infineon Technologies)

HIGH LINEARITY TRANSISTOR

3000

BFU520AVL

BFU520AVL

NXP Semiconductors

RF TRANS NPN 12V 10GHZ TO236AB

0

BFU730F,115

BFU730F,115

NXP Semiconductors

RF TRANS NPN 2.8V 55GHZ 4DFP

35017

2SC4713KT146R

2SC4713KT146R

ROHM Semiconductor

RF TRANS NPN 6V 800MHZ SMT3

0

KSC1730YBU

KSC1730YBU

RF SMALL SIGNAL TRANSISTOR

584790

CA3246M

CA3246M

HIGH FREQUENCIES NPN TRANSISTOR

514

HFA3127RZ

HFA3127RZ

Intersil (Renesas Electronics America)

RF TRANS 5 NPN 12V 8GHZ 16QFN

129

BFP193E6327

BFP193E6327

BFP193 - HIGH LINEARITY SI- AND

14115

MRF587

MRF587

Metelics (MACOM Technology Solutions)

TRANS RF NPN 17A 200MA 244A-01

0

PH1090-550S

PH1090-550S

Metelics (MACOM Technology Solutions)

RF TRANS NPN 80V

40

BFP640ESDH6327XTSA1

BFP640ESDH6327XTSA1

IR (Infineon Technologies)

RF TRANS NPN 4.7V 46GHZ SOT343

5580

2SC5095-R(TE85L,F)

2SC5095-R(TE85L,F)

Toshiba Electronic Devices and Storage Corporation

RF TRANS NPN 10V 10GHZ SC70

5353

Transistors - Bipolar (BJT) - RF

1. Overview

Radio Frequency Bipolar Junction Transistors (RF BJTs) are three-layer semiconductor devices optimized for amplification and switching in high-frequency applications (typically >100 MHz). These transistors maintain stable performance in microwave and ultra-high frequency (UHF) ranges, characterized by high current gain-bandwidth product (fT), low noise figures, and fast switching capabilities. Their importance in modern technology spans wireless communication infrastructure, radar systems, and RF test equipment, enabling efficient signal transmission and reception in 5G networks, satellite communications, and IoT devices.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
NPN RF BJTHigh electron mobility, optimized for low-noise amplification5G base station LNAs, GPS receivers
PNP RF BJTComplementary design for power amplificationRF power modules, automotive radar
RF Darlington PairHigh (current gain), cascaded amplificationAntenna drivers, industrial RF heaters
Heterojunction Bipolar Transistor (HBT)Compound semiconductor materials (SiGe/GaAs), ultra-high fTOptical communication transceivers, mmWave systems

3. Structure & Composition

Typical RF BJT structure includes:

  • Material: Silicon (Si), Silicon-Germanium (SiGe), Gallium Arsenide (GaAs)
  • Layer Architecture: Emitter (high doping), Base (thin layer), Collector (graded doping)
  • Package Types: Surface-mount (SOT-89, SOT-343), Through-hole (TO-18, TO-92)
  • Metallization: Gold/aluminum contacts for reduced parasitic resistance

Advanced designs incorporate air-bridge structures to minimize parasitic capacitance and epitaxial layers for improved frequency response.

4. Key Technical Parameters

ParameterDescriptionTypical Range
fT (Transition Frequency)Current gain cutoff frequency1 GHz - 100 GHz
GUM (Max. Available Gain)Power gain at optimal impedance10 dB - 30 dB
Pout (Output Power)RMS power capability0.1 W - 500 W
NF (Noise Figure)Signal-to-noise degradation0.3 dB - 5 dB
VCE0 (Breakdown Voltage)Collector-emitter withstand voltage5 V - 80 V
(Junction Temperature)Thermal stability limit150 C - 200 C

5. Application Fields

  • Telecommunications: 5G massive MIMO amplifiers, fiber optic transceivers
  • Defense: Phased array radar systems, electronic warfare jammers
  • Test & Measurement: RF signal generators, spectrum analyzers
  • Consumer Electronics: Bluetooth LE modules, Wi-Fi 6E front-ends
  • Industrial: Plasma generators, RFID readers

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specifications
Infineon TechnologiesBFP740FfT=50 GHz, NF=0.8 dB, Pout=18 dBm
STMicroelectronicsSTAG21412.7 GHz dual-stage amplifier, 32 dB gain
Skyworks SolutionsASK240110.05-6 GHz, 50 W GaAs power transistor
ON SemiconductorMRF151G125 W, 880 MHz, 40% efficiency

7. Selection Guidelines

Key considerations:

  1. Match fT to application frequency with 20% margin
  2. Verify load-line requirements for power applications
  3. Select appropriate package for thermal dissipation (e.g., TO-220 for >50 W)
  4. Derate VCE0 by 30% in high-temperature environments
  5. Consider integrated solutions (RFICs) for complex impedance matching

8. Industry Trends

Future development directions:

  • Transition to SiGe BiCMOS technology for 100+ GHz applications
  • Integration with GaN-on-SiC substrates for hybrid power amplifiers
  • Development of 5G NR direct-conversion transmitters using HBT arrays
  • Advancements in wafer-level packaging (WLP) for mmWave 5G devices
  • Adoption of AI-driven parameter optimization in production testing
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