Evaluation Boards - Expansion Boards, Daughter Cards

Image Part Number Description / PDF Quantity Rfq
DFR0488

DFR0488

DFRobot

FIREBEETLE LED MATRIX RED

0

DFR0505

DFR0505

DFRobot

SIM7000C ARDUINO NB-IOT/LTE/GPRS

26

SEN0213

SEN0213

DFRobot

GRAVITY: HEART RATE MONITOR SENS

86

DFR0684

DFR0684

DFRobot

RS485 CONNECTOR EXPANSION SHIELD

0

DFR0745

DFR0745

DFRobot

VOICE RECORDER MODULE-BREAKOUT

7

DFR0019

DFR0019

DFRobot

PROTOTYPING SHIELD FOR ARDUINO

3

DFR0450

DFR0450

DFRobot

EXPANSION SHIELD X600 FOR RASPBE

0

DFR0077

DFR0077

DFRobot

MAX202 RS232 TO TTL CONVERTER FO

67

SEN0305

SEN0305

DFRobot

GRAVITY: HUSKYLENS - AN EASY-TO-

16

DFR0348

DFR0348

DFRobot

3.5&QUOT TFT RESISTIVE TOUCH SH

0

SEN0198

SEN0198

DFRobot

GRAVITY: ANALOG HIGH TEMPERATURE

10

DFR0034

DFR0034

DFRobot

GRAVITY:ANALOG SOUND SENSOR

30

FIT0730

FIT0730

DFRobot

2 MEGAPIXELS USB NIGHT CAMERA (W

0

DFR0439

DFR0439

DFRobot

ADDRESS LED STRIP 4M

0

DFR0131

DFR0131

DFRobot

PROTO SCREW SHIELD-ASSEMBLED (AR

2

DFR0534

DFR0534

DFRobot

GRAVITY: UART MP3 VOICE MODULE

112

DFR0675-EN

DFR0675-EN

DFRobot

STEREOBLUETOOTHAMPLIFIERBOARD

69

DFR0117

DFR0117

DFRobot

EEPROM DATA STORAGE MODULE FOR A

10

DFR0028

DFR0028

DFRobot

GRAVITY: DIGITAL TILT SENSOR FOR

8

DFR0627

DFR0627

DFRobot

GRAVITY I2C TO DUAL UART MODULE

40

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microcontroller EVBsARM/FPGA SoC integration, onboard sensors, debug interfacesIoT edge devices, smart sensors
Expansion BoardsStandard interfaces (PCIe, USB-C), protocol convertersIndustrial gateways, communication modules
Daughter CardsSpecialized functionality modules (ADC/DAC, RF transceivers)Medical imaging equipment, test instruments
Programmer KitsFlash programming, JTAG/SWD debugging, voltage monitoringAutomotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

  • Multi-layer PCB with high-speed traces
  • Processor sockets or soldered-down SoCs
  • Standardized connectors (2.54mm headers, M.2)
  • Onboard memory (RAM, Flash storage)
  • Power management ICs and voltage regulators
  • Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

ParameterDescription
Clock SpeedDetermines processing capability (1MHz-2GHz range)
Bus WidthMemory bandwidth (8/16/32-bit configurations)
Interface SupportUSB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power ConsumptionTypical range: 0.5W-25W (varies with workload)
Operating TemperatureIndustrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

  • Telecommunications (5G base stations, optical transceivers)
  • Medical equipment (MRI scanners, patient monitors)
  • Industrial automation (PLC controllers, robotics)
  • Consumer electronics (smart home devices, wearables)
  • Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

VendorProduct Series
XilinxZynq UltraScale+ MPSoC Evaluation Kit
IntelStratix 10 GX FPGA Development Board
STMicroelectronicsSTM32 Nucleo Expansion Boards
Texas InstrumentsProcessor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

  • Match SoC architecture to target application requirements
  • Verify interface compatibility with existing systems
  • Evaluate available ecosystem (IDE support, middleware)
  • Consider power budget and thermal management needs
  • Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

  • Integration of AI accelerators (NPU modules)
  • Adoption of 5nm/3nm process technologies
  • Expansion of RISC-V based evaluation platforms
  • Increased focus on functional safety (ISO 26262 compliance)
  • Growing adoption of modular "Lego-style" prototyping systems
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