Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
DFR0013 DFRobot	IIC TO GPIO SHIELD V2.0	0
SEN0202 DFRobot	3D GESTURE SENSOR (MINI) FOR ARD	1
SEN0138-L DFRobot	CRASH SENSOR(LEFT)	3
DFR0258 DFRobot	RS232 SHIELD FOR ARDUINO	60
DRI0039 DFRobot	QUAD MOTOR DRIVER SHIELD FOR ARD	18
DFR0576 DFRobot	GRAVITY: DIGITAL 1-TO-8 I2C MULT	9
SEN0224 DFRobot	GRAVITY: I2C TRIPLE AXIS ACCELER	25
DFR0578 DFRobot	GRAVITY EXPANSION OPENMV CAM M7	8
DFR0352 DFRobot	WRTNODE STANDARD SHIELD	0
DFR0482 DFRobot	FIREBEETLE PROTO BOARD DOUBLER	4
DFR0521 DFRobot	MICRO:BIT EXPANSION BOARD FOR BO	1
DFR0009-BP DFRobot	PCB OF ARDUINO LCD KEYPAD SHIELD	0
DFR0075 DFRobot	GRAVITY:ANALOG ADKEYBOARD MODULE	0
DFR0017 DFRobot	GRAVITY: RELAY MODULE V3.1	200
SEN0248 DFRobot	GRAVITY: I2C BME680 ENVIRONMENTA	33
DFR0095 DFRobot	GRAVITY:DIGITAL IR TRANSMITTER M	0
DFR0413 DFRobot	0.96 INCH OLED DISPLAY MODULE FO	0
FIT0729 DFRobot	8 MEGAPIXELS USB CAMERA (WITH MI	0
SEN0129 DFRobot	ANALOG GAS SENSOR(MQ4)	10
DFR0054 DFRobot	GRAVITY:ANALOG ROTATION SENSOR V	6

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems