Evaluation Boards - Expansion Boards, Daughter Cards

Image Part Number Description / PDF Quantity Rfq
DFR0536

DFR0536

DFRobot

MICRO GAMEPAD

45

DFR0518

DFR0518

DFRobot

MICRO:MATE - A MINI EXPANSION BO

5

SEN0291

SEN0291

DFRobot

GRAVITY: I2C DIGITAL WATTMETER

52

TEL0126

TEL0126

DFRobot

GRAVITY: WIFI IOT MODULE

25

DFR0061

DFR0061

DFRobot

GRAVITY: JOYSTICK MODULE V2

4

DFR0062

DFR0062

DFRobot

WIICHUCK ADAPTER (ARDUINO COMPAT

0

DFR0469

DFR0469

DFRobot

GRAVITY: I2C SD2405 RTC MODULE

5

SEN0133

SEN0133

DFRobot

ANALOG HYDROGEN GAS SENSOR (MQ8)

0

DFR0008

DFR0008

DFRobot

INPUT SHIELD FOR ARDUINO

2

DFR0171

DFR0171

DFRobot

SCREW SHIELD V2 FOR ARDUINO

19

SEN0228

SEN0228

DFRobot

GRAVITY: I2C VEML7700 AMBIENT LI

0

DFR0508

DFR0508

DFRobot

FIREBEETLE COVER MOTOR CTRL

28

SEN0189

SEN0189

DFRobot

GRAVITY: ANALOG TURBIDITY SENSOR

3

DFR0592

DFR0592

DFRobot

DC MOTOR DRIVER HAT(V1.0)

23

SEN0197

SEN0197

DFRobot

GRAVITY: VOICE RECORDER MODULE

8

SEN0203

SEN0203

DFRobot

HEART RATE SENSOR

22

DFR0260

DFR0260

DFRobot

DMX SHIELD FOR ARDUINO

19

DFR0027

DFR0027

DFRobot

GRAVITY: DIGITAL VIBRATION SENSO

0

DFR0154

DFR0154

DFRobot

I2C 20X4 ARDUINO LCD DISPLAY MOD

0

DFR0357

DFR0357

DFRobot

EXPANSION SHIELD X200 FOR RASPBE

0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microcontroller EVBsARM/FPGA SoC integration, onboard sensors, debug interfacesIoT edge devices, smart sensors
Expansion BoardsStandard interfaces (PCIe, USB-C), protocol convertersIndustrial gateways, communication modules
Daughter CardsSpecialized functionality modules (ADC/DAC, RF transceivers)Medical imaging equipment, test instruments
Programmer KitsFlash programming, JTAG/SWD debugging, voltage monitoringAutomotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

  • Multi-layer PCB with high-speed traces
  • Processor sockets or soldered-down SoCs
  • Standardized connectors (2.54mm headers, M.2)
  • Onboard memory (RAM, Flash storage)
  • Power management ICs and voltage regulators
  • Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

ParameterDescription
Clock SpeedDetermines processing capability (1MHz-2GHz range)
Bus WidthMemory bandwidth (8/16/32-bit configurations)
Interface SupportUSB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power ConsumptionTypical range: 0.5W-25W (varies with workload)
Operating TemperatureIndustrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

  • Telecommunications (5G base stations, optical transceivers)
  • Medical equipment (MRI scanners, patient monitors)
  • Industrial automation (PLC controllers, robotics)
  • Consumer electronics (smart home devices, wearables)
  • Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

VendorProduct Series
XilinxZynq UltraScale+ MPSoC Evaluation Kit
IntelStratix 10 GX FPGA Development Board
STMicroelectronicsSTM32 Nucleo Expansion Boards
Texas InstrumentsProcessor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

  • Match SoC architecture to target application requirements
  • Verify interface compatibility with existing systems
  • Evaluate available ecosystem (IDE support, middleware)
  • Consider power budget and thermal management needs
  • Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

  • Integration of AI accelerators (NPU modules)
  • Adoption of 5nm/3nm process technologies
  • Expansion of RISC-V based evaluation platforms
  • Increased focus on functional safety (ISO 26262 compliance)
  • Growing adoption of modular "Lego-style" prototyping systems
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