Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
DFR0105 DFRobot	POWER SHIELD (ARDUINO COMPATIBLE	3
SEN0159 DFRobot	CO2 GAS SENSOR (ARDUINO COMPATIB	1
DFR0053 DFRobot	GRAVITY:ANALOG SLIDE POSITION SE	10
SEN0290 DFRobot	GRAVITY: LIGHTNING SENSOR	22
SEN0315 DFRobot	GRAVITY PAJ7620U2 GESTURE SENSOR	34
SEN0318 DFRobot	GRAVITY: CCS811 AIR QUALITY SENS	14
DFR0229 DFRobot	MICROSD CARD MODULE FOR ARDUINO	79
DFR0734 DFRobot	RS232 CONNECTOR EXPANSION SHIELD	25
DFR0448 DFRobot	ADDRESS LED STRIP WHITE 4M	0
SEN0017 DFRobot	LINE TRACKING SENSOR FOR ARDUINO	1
DFR0457 DFRobot	GRAVITY: MOSFET POWER CONTROLLER	81
DFR0553 DFRobot	GRAVITY: I2C ADS1115 16-BIT ADC	9
SEN0331 DFRobot	SHT31 TEMP & HUMIDITY SENSOR BRD	58
DFR0032 DFRobot	GRAVITY: DIGITAL BUZZER MODULE	18
DFR0031-G DFRobot	GRAVITY:DIGITAL PIRANHA LED MODU	0
DFR0588 DFRobot	GRAVITY: ANALOG SHT30 TEMPERATUR	15
SEN0388 DFRobot	GRAVITY: URM09 ULTRASONIC SENSOR	14
FIT0731 DFRobot	PAN-TILT HAT FOR RASPBERRY PI AN	0
SEN0098 DFRobot	50A CURRENT SENSOR(AC/DC)	15
TEL0122 DFRobot	FIREBEETLE COVERS-LORA RADIO 915	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems