Evaluation Boards - Expansion Boards, Daughter Cards

Image Part Number Description / PDF Quantity Rfq
DFR0029-R

DFR0029-R

DFRobot

GRAVITY: DIGITAL PUSH BUTTON (RE

5

DFR0554

DFR0554

DFRobot

GRAVITY: I2C 16X2 ARDUINO LCD WI

30

SEN0376

SEN0376

DFRobot

GRAVITY: ALCOHOL SENSOR (0-5PPM)

7

DFR0021-R

DFR0021-R

DFRobot

GRAVITY:DIGITAL RED LED LIGHT MO

0

SEN0365

SEN0365

DFRobot

DFROBOT AS7341 11-CHANNEL VISIBL

33

DFR0224

DFR0224

DFRobot

SCREWLESS TERMINAL SHIELD

2

DFR0382

DFR0382

DFRobot

7 SEGMENT LED KEYPAD SHIELD FOR

14

DFR0472

DFR0472

DFRobot

32X32 RGB LED MATRIX PANEL (4MM

2

SEN0240

SEN0240

DFRobot

GRAVITY ANALOG EMG SENSOR BY OYM

4

SEN0193

SEN0193

DFRobot

GRAVITY: ANALOG CAPACITIVE SOIL

36

DFR0259

DFR0259

DFRobot

RS485 SHIELD

115

SEN0192

SEN0192

DFRobot

GRAVITY: DIGITAL MICROWAVE SENSO

25

DFR0660

DFR0660

DFRobot

CM65 QR & BARCODE SCANNER MODULE

0

SEN0311

SEN0311

DFRobot

A02YYUW WATERPROOF ULTRASONIC SE

79

SEN0231

SEN0231

DFRobot

GRAVITY: FORMALDEHYDE (HCHO) SEN

11

DFR0052

DFR0052

DFRobot

GRAVITY: DIGITAL PIEZO DISK VIBR

6

SEN0185

SEN0185

DFRobot

GRAVITY: DIGITAL HALL SENSOR

17

DFR0468

DFR0468

DFRobot

FIREBEETLE LED MATRIX GREEN

0

DFR0528

DFR0528

DFRobot

UPS HAT FOR RASPBERRY PI ZERO

6

DFR0502

DFR0502

DFRobot

GRAVITY: IO EXPANSION MOTOR CTRL

0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microcontroller EVBsARM/FPGA SoC integration, onboard sensors, debug interfacesIoT edge devices, smart sensors
Expansion BoardsStandard interfaces (PCIe, USB-C), protocol convertersIndustrial gateways, communication modules
Daughter CardsSpecialized functionality modules (ADC/DAC, RF transceivers)Medical imaging equipment, test instruments
Programmer KitsFlash programming, JTAG/SWD debugging, voltage monitoringAutomotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

  • Multi-layer PCB with high-speed traces
  • Processor sockets or soldered-down SoCs
  • Standardized connectors (2.54mm headers, M.2)
  • Onboard memory (RAM, Flash storage)
  • Power management ICs and voltage regulators
  • Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

ParameterDescription
Clock SpeedDetermines processing capability (1MHz-2GHz range)
Bus WidthMemory bandwidth (8/16/32-bit configurations)
Interface SupportUSB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power ConsumptionTypical range: 0.5W-25W (varies with workload)
Operating TemperatureIndustrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

  • Telecommunications (5G base stations, optical transceivers)
  • Medical equipment (MRI scanners, patient monitors)
  • Industrial automation (PLC controllers, robotics)
  • Consumer electronics (smart home devices, wearables)
  • Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

VendorProduct Series
XilinxZynq UltraScale+ MPSoC Evaluation Kit
IntelStratix 10 GX FPGA Development Board
STMicroelectronicsSTM32 Nucleo Expansion Boards
Texas InstrumentsProcessor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

  • Match SoC architecture to target application requirements
  • Verify interface compatibility with existing systems
  • Evaluate available ecosystem (IDE support, middleware)
  • Consider power budget and thermal management needs
  • Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

  • Integration of AI accelerators (NPU modules)
  • Adoption of 5nm/3nm process technologies
  • Expansion of RISC-V based evaluation platforms
  • Increased focus on functional safety (ISO 26262 compliance)
  • Growing adoption of modular "Lego-style" prototyping systems
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