Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
SEN0286 DFRobot	LATTEPANDA 5MP UVC CAMERA	39
DFR0009 DFRobot	1602 LCD KEYPAD SHIELD FOR ARDUI	0
DFR0471 DFRobot	32X16 RGB LED MATRIX PANEL (6MM	26
DFR0464 DFRobot	GRAVITY I2C 16X2 ARDUINO LCD WI	29
DFR0487 DFRobot	FIREBEETLE LED MATRIX YELLOW	0
DFR0641 DFRobot	DS3231M MEMS PRECISE RTC	62
DFR0375 DFRobot	COOKIE-IO EXPANSION SHIELD	0
DFR0257 DFRobot	IO EXPANSION SHIELD FOR LAUNCHPA	1
DFR0256 DFRobot	MEGA MULTI -ARDUINO MEGA EXPANSI	0
DFR0485 DFRobot	FIREBEETLE LED MATRIX BLUE	0
SEN0019 DFRobot	ADJUSTABLE INFRARED DISTANCE SEN	3
TEL0121 DFRobot	FIREBEETLE COVERS-LORA RADIO 433	0
SEN0252 DFRobot	GRAVITY: BMX160+BMP388 10 DOF SE	15
DFR0265 DFRobot	GRAVITY:IO EXPANSION SHIELD FOR	16
DFR0026 DFRobot	GRAVITY: ANALOG AMBIENT LIGHT SE	0
DRI0027 DFRobot	SMART ARDUINO DIGITAL SERVO SHIE	0
DFR0481 DFRobot	FIREBEETLE COVERS-PROTO BOARD	4
SEN0127 DFRobot	ANALOG GAS SENSOR(MQ2)	13
DRI0017 DFRobot	2X2A MOTOR SHIELD FOR ARDUINO TW	4
SEN0226 DFRobot	GRAVITY: I2C BMP280 BAROMETER SE	5

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems