Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
DFR0023 DFRobot	GRAVITY:ANALOG LM35 LINEAR TEMPE	11
DRI0023 DFRobot	DUAL BIPOLAR STEPPER MOTOR SHIEL	2
DFR0782 DFRobot	EVALUATION BOARD FOR AUDIO BLE/	25
DFR0067 DFRobot	GRAVITY:DHT11 TEMPERATURE AND HU	81
SEN0173 DFRobot	CAMERA FOR RASPBERRY PI	2
FIT0701 DFRobot	USB CAMERA FOR RASPBERRY PI AND	30
SEN0160 DFRobot	GRAVITY:DIGITAL WEIGHT SENSOR	73
SEN0342 DFRobot	SONY SPRESENSE CAMERA BOARD (ISX	0
SEN0262 DFRobot	GRAVITY ANALOG CURRENT TO VOLTAG	9
DFR0577 DFRobot	GRAVITY: I/O EXPANSION SHIELD FO	33
DFR0022 DFRobot	GRAVITY:ANALOG GRAYSCALE SENSOR	0
DFR0504 DFRobot	GRAVITY: ANALOG SIGNAL ISOLATOR	16
FIT0511 DFRobot	GRAVITY 4PIN SENSOR ADAPTER	0
SEN0209 DFRobot	GRAVITY: FLEXIBLE PIEZO FILM VIB	15
SEN0212 DFRobot	GRAVITY RGB COLOR SENSOR	0
TEL0075 DFRobot	315MHZ RF SHIELD FOR ARDUINO	2
DFR0484 DFRobot	FIREBEETLE LED MATRIX WHITE	0
SEN0205 DFRobot	GRAVITY: ANALOG LIQUID LEVEL SEN	7
DFR0331 DFRobot	ROMEO BOARD WITHOUT INTEL EDISON	0
SEN0171 DFRobot	PIR (MOTION) SENSOR	15

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems