Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
DFR0768 DFRobot	DFROBOT DFPLAYER PRO - A MP3 PLA	0
SEN0138-R DFRobot	CRASH SENSOR(RIGHT)	0
DFR0072 DFRobot	SHIFTOUT MODULE	2
DFR0672 DFRobot	SMART COOLING HAT FOR RASPBERRY	42
DFR0015 DFRobot	XBEE SHIELD FOR ARDUINO	32
DFR0423 DFRobot	GRAVITY:DIGITAL SELF-LOCKING SWI	0
DFR0021-G DFRobot	GRAVITY: DIGITAL GREEN LED LIGHT	0
DFR0074 DFRobot	INTERFACE SHIELD FOR ARDUINO	0
DFR0563 DFRobot	GRAVITY: I2C 3.7V LI BATTERY FUE	0
MBT0009 DFRobot	MICRO: BREADBOARD	44
MBT0012 DFRobot	MICRO: IOT - MICRO:BIT IOT EXPAN	24
DFR0327 DFRobot	ARDUINO EXPANSION SHIELD FOR RAS	1
SEN0307 DFRobot	GRAVITY: URM09 ANALOG ULTRASONIC	21
SEN0223 DFRobot	GRAVITY: CONDUCTIVITY SENSOR SWI	0
MBT0005 DFRobot	MICRO: IO-BOX EXPANSION BOARD	59
SEN0175 DFRobot	UV SENSOR V1.0 - ML8511	0
DFR0591 DFRobot	RASPBERRY PI E-INK DISPLAY MODUL	21
DFR0646-R DFRobot	GRAVITY 8-DIGIT LED SEGMENT RED	11
DFR0031-B DFRobot	GRAVITY:DIGITAL PIRANHA LED MODU	0
DFR0031-R DFRobot	GRAVITY:DIGITAL PIRANHA LED MODU	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems